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PCB Reliability Test
The printed circuit board (PCB, PWB) is the mother of all electronics—a platform that connects various components together.
Unlike the other parts of these products, which can be repaired or replaced when faults occur, abnormalities in printed circuit boards are more difficult to deal with and often lead to the scrapping of entire batches of products. Therefore, reliability tests for printed circuit boards should be no less rigorous than the tests conducted on other electronic components.
Printed circuit boards can be divided into Rigid PCB, Flexible PCB, and Rigid-Flex hybrid PCB.
Structurally, they can be divided into Single-Sided PCB, Double-Sided PCB, Multilayer PCB, and High-Density Interconnection boards (HDI).
After decades of development, the IPC has established clear requirements on the specifications for the electrical characteristics, appearance, materials, reliability, etc. of PCBs. The use of IPC documents is popular among both manufacturers and users. The most commonly referred to of these documents are as follows
- IPC-A-600：Acceptability of Printed Boards
- IPC-6011：Generic Performance. Specification for. Printed Boards
- IPC-6012：Qualification and. Performance Specification for Rigid Printed Boards.
- IPC-6013：Qualification and. Performance Specification for Flexible Printed Boards
- IPC-6016：Qualification and Performance. Specification for High Density.Interconnect (HDI) Layers or Boards
- IPC-TM650：IPC Test Methods Manual
In recent years, the automotive industry has become the largest market for printed circuit boards. It is now a blue ocean market that many manufacturers strive to enter. However, there are strict reliability requirements for automotive products, which are expected to endure a variety of harsh environments. Therefore, printed circuit board reliability testing has once again become a focus. In response, major automotive manufacturers have developed customized test standards. This situation has also provided an opening into the field for printed circuit board factories.
MA-tek is the PCB industry’s all-round reliability services provider to provide total solution platform for integrated technical services.
MA-tek has longstanding, cooperative relationships with many prestigious, domestic PCB manufacturers for conducting materials analysis. We have now expanded to include reliability testing, failure analysis, and internal technology integration. We have also launched an innovative new series of tests that meet both IPC-TM650 standards and other specifications.
In regards to pretreatments, MA-tek’s new reflow furnace meets the IPC TM650 Method 2.6.27 specifications.
The Electrochemical Migration test can generate up to 500V of power and test the Surface Insulation Resistance (SIR) and Conductive Anodic Filament (CAF) in accordance to a variety of standards.
In regards to quality testing on interconnection holes, MA-tek provides low-resistance dynamic measurement equipment (Datalogger) that makes lifespan estimations more detailed and accurate.
In order to provide our customers with convenience and quality, MA-tek has established a dedicated Total Solution platform for integrated technical services and provides everything from experiment design to overall planning support and more. We are the PCB industry’s all-round reliability services provider.
IPC TM650 Method 2.6.26 Reflow Specifications and Measurement Diagrams
Example of an Electrochemical Migration Test Chart