As high-performance computing, artificial intelligence, advanced packaging (2.5D/3D ICs), and high-density PCBs continue to advance, the electronic components used to produce these technologies as well as their fabrication tolerances have only continued to shrink.
At this scale, measuring surface roughness, mapping step heights, profiling microstructures, and controlling surface topography are crucial for improving yield and maintaining product reliability.
To answer the demand for nanoscale surface analysis, MA-tek partnered with state-of-the-art, industry-recognized surface metrology company Sensofar Metrology and installed the Sensofar S Neox 3D Optical Profilometer. Equipped with confocal microscopy, white-light interferometry, and focus variation measurement functionality, the S Neox provides high-resolution, non-destructive, complete 3D measurements for its users.
Appearance of the SENSOFAR 3D Optical Profiler |
Scanning Results of a Silicon Photonic Component |
The S Neox 3D optical profiler specializes in topographical measurements including：
- Surface roughness (Ra/Rq/Sa/Sq)
- Microstructure height and depth profiling
- Line width, height, and length measurements
- Copper pillar and solder ball 3D optical profiling
- Surface analysis of silicon photonics structures
- Crater Test: Depth and width profiling
- IC packaging laser marker optical profiling
In advanced packaging, copper pillar bumps with uneven heights, faulty film deposition, and inconsistent via depths are a few of the many causes of mechanical stress and other reliability issues during production. However, we can monitor for these problems and adjust the parameters that need to be adjusted with the instrument’s high-resolution 3D topography visualization functions.
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Instrument Advantages |
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1. Non-contact, non-destructive measurement |
- Prevents any probe-induced damage or contamination. Suited for brittle materials and expensive samples
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2. Nanoscale, high-resolution analysis |
- White-light interferometry can reach sub-nanometer resolutions
- Confocal profiling allows measurement of surfaces with steep local slopes up to around 72°
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3. Measurement versatility across surfaces |
- Rough surfaces: Confocal Profiling
- Ultra-smooth surfaces: White-light Interferometry
- Complex profiles: Focus Variation
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4. Compatible with large samples |
- Maximal measurement area of 2cm * 2cm
- Supports measurement of 12 - inch wafers
- Operable under normal atmospheric conditions (no vacuums necessary)
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Applications |
✔ Semiconductor fabrication and packaging analysis
✔ PCB copper film surface roughness and via depth profiling
✔ Precision manufacturing and microelectronic components
✔ Surface quality assessment of medical implants
✔ Materials Science: Analysis and study of nanostructures
Through the S Neox 3D Optical Profiler's confocal, interferometry, and Focus Variation profiling techniques, MA-tek offers high-resolution, non-contact, non-destructive 3D measurements to help clients detect abnormalities, optimize key parameters, and establish a strong foundation during the early stages of product development.
➤ Further Reading：A Comprehensive Overview of 3D Optical Profiling Technologies
