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Laser re-balling

Technical Concept

Laser re-balling system is a semi-automatic solder ball placement reflow/rework machine designed for small volume production, prototyping, and research and development.

The maximum throughput is 5 balls per second. The ball diameters range from 100μm to 350μm. It is an ideal tool for BGA and CSP rework jobs during electrical characterization or final tests.






PacTech  SB2-M 






  • HDD (HGA, HSA, Hook-Up)
  • Flip-chip, BGA, cLCC, CSP
  • 3D packaging
  • 4- to 12-inch wafers
  • Repair/rework of BGA-like packages
  • Optoelectronics/Micro-optics
  • MEMS
  • Camera modules
  • Wafer bumping





  • Single-step solder ball placement and reflow.
  • Single ball reballing and engineering handling
  • No special tooling required
  • No additional reflow required
  • Solder-ball diameter from – 100µm to 350µm
  • High solder alloy flexibility – Eutectic SnPb, High-lead SnPb, Lead-free SnAg, SnAgCu, etc.
  • In-line capability & High throughput
  • High accuracy axis system
  • Automated fiducial alignment
  • Ball rework and repair capability
  • 3D Camera – Height auto measurement
  • 2D bump-inspection systems
  • Integrated laser power sensor
  • Solder rework & reballing station
  • Automatic handling/robot system
  • Tray Unit





Taiwan|SoC Lab

Chemical team

: +886-3-6116678 ext:3919/3920

: +886-922-301638

: chemical_hc@ma-tek.com