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Laser Decap

Technical Concept

Laser decap is used to remove the epoxy or compound of IC packages by laser irradiation. This technology has the advantage of precisely localizing decap and lessening IC damage caused by decapping.


Laser decapsulation can precisely control the decapsulation open window and it can also prevent the IC from being damaged due to over decapsulation by the chemical way.







Selective opening the epoxy by laser decap


Check the 2nd bond quality 




Taiwan|SoC Lab

Chemical team

: +886-3-6116678 ext:3919/3920

: +886-922-301638

: chemical_hc@ma-tek.com

Taiwan|JB Lab

Chemical team

: +886-3-6116678 ext : 1601/1614

: +886-970-923-650

: chemical_jb@ma-tek.com


Taiwan|Tainan Lab

Ms. Xu

: +886-3-6116678 ext:5212

: +886-979-509-675


Shanghai Lab

Chemical team

: +86-21-5079-3616 ext:7011

: 138-1673-1603



Xiamen Lab

Ms. Huang

: - - - - - - -

: 180-207-45619

: aliexhuang@ma-tek.com