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Non-destructive Analysis (NDA)

Circuit Edit (CKT)

Materials Analysis (MA)

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MA-tek FTP

Sustainability report

Thermal EMMI

Technical Concept

The principle of THEMOS is to use a highly sensitive InSb detector to sense the heat radiation generated from faults.

The compact and easy-to-use THEMOS mini is a novel non-destructive EFA tool used for fault isolation. It holds an impressive advantage of decapsulation unnecessary when inspecting failures via either the front side or back side of IC devices.

 

The principle of THEMOS is to use a highly sensitive InSb detector to sense the heat radiation generated from faults. Based on the heat distribution, the location of the “hot spot” can be identified not only in the x-y plane but also in the vertical axis with thermal-transport-related calculations. Therefore, THEMOS is a powerful FA tool for stacked die packages. It can be applied to FAs for ICs, packages, PCBs, panels, passive components, etc.

 

 

 

Equipment


Thermo ELITE


Thermo ELITE

 

Characteristics

Limit

 

Voltage Range

±3000V (@100mA)

Current Range

3A (@40V)

Lock-in Frequency

1Hz~89Hz

Wide-angle Lens  Range

30cm*30cm

Lens

WA、1X、10X、LSM20X、LSM50X

Features

Back probe, Image stitching

 Characteristics of Thermo ELITE

 

 

HAMAMATSU THEMOS mini

 

 

 

Applications

  • The most sensitive heat source detection system in the market
  • Real-time lock-in measurement and high SNR
  • High temperature resolution:<1 mK in a few seconds;<10 uK in a few hours
  • Abnormal resistance detection on via/contact, Bond wire short
  • Dielectric layer leakage /breakdown
  • Fault isolation for TFT-LCD leakage/Organic EL leakage
  • Abnormal temperature variation detection for devices under development
  • ESD and latch up effect
  • PCB metal trace defects or short
  • Hot spot vertical depth interpretation
  • Static and dynamic analysis

 

Thermal emission analysis image through IC's backside

 

 

(a) IC backside image + thermal emission  (b) Thermal emission 

 

 

Thermal emission analysis image through IC’s front side 

 

 

(a) IC appearance  (b) X-ray image  (c) Thermal emission image

  

 

Thermal emission heat source depth estimation

 

 

 

 

 

Contact

Taiwan|SoC Lab

EMMI team

: +886-3-6116678 ext:3910/3911 

: +886-952-301-632

hc_efa@ma-tek.com

Taiwan|JB Lab

EMMI team

: +886-3-6116678 ext:1608/1609

: +886-987-058-875

jb_efa@ma-tek.com

 

Shanghai Lab

EFA team

: +86-21-5079-3616 ext:7051

: 135-2431-3161

efa_sh@ma-tek.com

Xiamen Lab

Miss Huang

: - - - - - - -

: 180-2074-5619

: aliexhuang@ma-tek.com