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Non-destructive Analysis (NDA)

Circuit Edit (CKT)

Materials Analysis (MA)

Application Forms


MA-tek FTP

Sustainability report

2D X-ray

Technical Concept

2D X-ray imaging is shining X-ray radiation on an object of interest and taking its transmission contrast.

It can be used to inspect an IC’s internal metallic materials or structure, such as bond wire, silver glue, lead frame, etc.





MA-tek has Feinfocus FXS-160.40 TIGER X-RAY and Dage XD7600NT.



Window control screen


Dage XD 7600NT





X-ray is mainly used for examination of PCB assembly failures

  • Examination of solder on active/passivity components
  • Number of holes and ratio counting
  • Mixing-system components


The devices we could analyze:

  • Inductors/Sensors
  • Relay
  • Fuse
  • Coils/Winding
  • Bond wire
  • IC and die adhesion interface inspection



 (a) 0° Tilt, 0° Rotate;(b) 55° Tilt, 45° Rotate;(c) 55° Tilt, 135° Rotate;(d) 55° Tilt, 225° Rotate;(e) 55° Tilt, 315° Rotate





Taiwan|SoC Lab

Chemical team

: +886-3-6116678 ext:3919/3920

: +886-922-301-638

: chemical_hc@ma-tek.com

Taiwan|JB Lab

Chemical team

: +886-3-6116678 ext : 1601/1614

: +886-970-923-650

: chemical_jb@ma-tek.com


Shanghai Lab

Chemical team

: +86-21-5079-3616 ext:7011

: 138-1673-1603


Xiamen Lab

Miss Huang

: - - - - - - -

: 181-5013-6151

: chemical_xm@ma-tek.com




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