IC Packaging and Testing

IC packaging and testing are key stages after the chip has completed wafer manufacturing. The purpose of packaging is not only to protect the chip but also to connect the chip to the system circuit board and complete the heat dissipation path design with stable electrical and mechanical strength through techniques such as redistribution layer (RDL), wire bonding or bump bonding, and underfill. As the integration and bandwidth requirements of chips increase, packaging is no longer a simple structural operation but a critical link that directly affects signal integrity, thermal management, reliability, and system performance. In actual processes, factors such as the properties of packaging materials, RDL and bump structures, differences in thermal expansion between layers, and soldering and reflow conditions can cause interface weakening, cracks, metal voids, or electrical shifts. These issues may arise at different stages during the early packaging, system assembly, and lifespan, thus requiring structural analysis and stress assessment to establish traceable judgment criteria. MA-tek assists packaging and testing manufacturers in the processes of sample introduction, mass production scaling, packaging conversion, and customer complaint response by providing cross-sectional structure verification, packaging interface integrity analysis, post-packaging electrical change determination, and reliability lifespan assessment. Through high-resolution profile measurement and non-destructive testing, abnormal locations and formation mechanisms can be confirmed; through reliability testing, the stability of packaging components under temperature cycling, humidity loading, and mechanical stress conditions can be predicted.