Environmental Stress Testing
Environmental stress testing is primarily focused on the verification of the assembly quality of components, with several important considerations. The first is the temperature resistance level of the packaging; the second is the moisture absorption resistance level of the packaging; the third is the methods of preservation and control. From the completion of component production to its use in the hands of customers, the first issue faced is the thermal shock problem encountered during the assembly process, whether through SMT or DIP, and only then will the issue of lifespan be considered.
Additionally, due to the continuous pollution of the Earth's environment by humans, the air and rainwater are becoming increasingly acidic, which affects the preservation management and service life of many component materials. Therefore, when conducting environmental tests at the component stage, it is necessary to consider the characteristics of the usage environment for exposed parts such as connectors, certain PCB applications, terminals, and metal products, and to carry out corrosion testing. The following is an explanation of the component reliability services that our company can currently provide:
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Moisture Sensitivity Level / MSL
Mainly aimed at verifying surface mount devices (SMD) or components that have undergone the SMT reflow process. The judgment method primarily uses ultrasonic scanning (SAT or SAM) to determine the delamination position and delamination ratio, and thus establish the moisture sensitivity level.
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Precondition Test
The testing method is similar to that of moisture sensitivity levels, but the purpose is different. The purpose of preconditioning is to simulate the cycle process of parts from production, transportation, to customer online usage. The moisture absorption conditions of preconditioning are based on the moisture sensitivity level of the parts, but due to the similar processes, many component manufacturers in the industry combine these two operations based on experience.
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Temperature Cycling Test
Temperature cycling testing is a very important part of reliability testing. By alternating the parts between cold and hot for several cycles, it examines the impact of fatigue aging on the product through the difference in expansion coefficients. This experiment is the most commonly used reliability testing standard, closely resembling the actual usage conditions of the product during power on and off. -
高溫貯存試驗 (High Temperature Storage Test)
The purpose of this test is to verify the thermal aging state of the packaging materials, accelerating the aging of the packaging materials under continuous high temperature conditions.
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低溫貯存試驗 (Low Temperature Storage Test)
The purpose of this test is to verify the low-temperature resistance of packaging materials. At extremely low temperatures, mechanical deformation caused by expansion and contraction is used to examine cracks induced by embrittlement of the component structure. -
Temperature Humidity Storage Test
Through a high-temperature and high-humidity environment, the corrosion phenomenon of components caused by accelerated chemical reactions is often tested using bias tests on the metal materials of the package, in addition to static environmental tests, which can also simultaneously test the product's corrosion resistance.
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Highly Accelerated Stress Test
Similar to the principles of temperature and humidity storage testing, the difference lies in the fact that during the humidification process, a higher temperature creates an environment with pressure greater than atmospheric pressure, which accelerates the corrosion rate, causing internal corrosion in poorly packaged products. -
High Temperature Steam Pressure Test (Pressure Cook Test)
This experiment provides an environment of two atmospheric pressures, usually used for process quality verification, to test the moisture resistance capability of semiconductor packaging. If unreliable testing methods are used, some materials, such as BGA substrates, may suffer excessive damage.
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Temperature shock test (Thermal shock Test / Liquid to Liquid)
Similar to the principle of temperature cycling tests, the difference is the accelerated rate of temperature change, determining the product's resistance when exposed to extreme high and low temperature conditions, which can detect defects such as packaging seal, grain bonding, wire bonding, and substrate cracks. -
Dual Chamber Thermal Shock Test (Thermal Shock Test / Air to Air)
Unlike the traditional TCT test temperature change rate, the dual-chamber temperature shock testing machine is suitable for larger samples and can transfer the test item from one temperature to another in a very short time, making it more representative for verification in specific environments such as automotive products.
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Salt Spray Test
Salt spray testing can simulate the metal corrosion conditions of parts used in harsher environments. This test mainly focuses on the quality of metal surface treatment, especially when products are used in island environments or areas with higher salt content. It is well known that products may experience poor contact due to accelerated corrosion. Salt spray testing can quickly verify process or manufacturing quality.
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Gas Corrosion
Due to the increasingly severe air pollution on Earth, being in such an industrial environment, whether from factory emissions or vehicle exhaust, can cause harm to various electronic products. The purpose of gas corrosion testing is primarily to verify the corrosion resistance quality of the electroplating or coating on the surface of products or components, to ensure the lifespan of the product. Unlike salt spray testing, gas corrosion testing has a broader scope and is more closely related to actual application environments.
MA-tek gathers industry veterans with many years of experience in semiconductor component reliability testing. To provide customers with a more convenient service platform, it has also established a dedicated window for integrated technical services (Total Solution), offering experimental design and overall planning, among others. To ensure the stability of experimental quality, the company uses internationally renowned brand equipment to provide customers with the most stable test results and the best testing environment. According to product technical specifications and customer requirements, MA-tek can perform reliability testing according to various standards such as MIL-STD, JEDEC, IEC, JESD, AEC, EIA, etc.
