Electrical FA

Electrical anomalies related to packaging may lead to product functionality failure or yield decline. Through electrical failure analysis, issues such as short circuits, leakage currents, or electrostatic damage can be analyzed to identify the true cause of failure.

Service Scope

• Multiple testing modes: HBM, MM, Socket CDM, Non-Socket CDM, Latch-up

• Complete temperature testing range: room temperature to high temperature testing (-20 °C to 225 °C)

• Dynamic Latch-up testing capability: supports high-frequency Vector Input Board.

• Universal BGA Socket, suitable for ESD/Latch-up testing

• Support COB and various packaged IC testing, including BGA, QFN, QFP, DIP, TSOP, etc.

• Provide wire bonding and packaging services:

  • Gold Wire / Aluminum Wire Bonding (Au / Al Wire Bonding)

  • Die Mount

  • Epoxy packaging

• System-level ESD testing:

  • Testing of modules, motherboards, and overall electronic systems using ESD Gun

Customized services

• Establish ESD/Latch-up design rules.

• I/O Cell Library and specific Pad circuit design

• ESD protection architecture consulting and optimization recommendations

Delivery Commitment

• 24-hour report deliveryTotal test time ≦ 5 hours

• Report delivery within 48 hoursTotal test time ≦ 15 hours

Product Failure Analysis

(a )I-V Curve；(b) SAT；(c) X-ray；(d) SEM；(e) SEM；(f) SEM