IC manufacturing is in the midstream of the semiconductor industry chain, which involves producing the core processes on silicon wafers based on the designed circuit blueprint through high-precision physical and chemical technologies. The basic process includes wafer preparation and oxidation, photolithography transfer through a mask, plasma cleaning and wet etching to remove excess materials, thin film deposition, physical vapor deposition (PVD), chemical vapor deposition (CVD), atomic layer deposition (ALD), ion implantation or doping to change the conductivity of components, copper dual-damascene electroplating, and chemical-mechanical planarization (CMP) to smooth the surface. This process is akin to nano-scale 3D printing, where steps are repeated in a clean room to achieve complex circuit structures.