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α-step thin film thickness profile measurement instrument

Technical Principles

The film thickness profile measurement instrument (α-Step) is a precision instrument that uses mechanical probe scanning to measure surface profiles. The system employs a diamond-tipped probe (Stylus) to perform linear scanning on the sample surface. As the probe traverses the surface structure of the sample, it experiences vertical displacement due to changes in surface height.

The vertical movement of the probe is recorded by a high-sensitivity sensor and converted into an electrical signal. Through the instrument system, a one-dimensional surface profile of the sample can be reconstructed. By analyzing the profile curve, information such as height variation, step height, and roughness of the sample surface can be obtained. The α-Step is particularly suitable for film thickness measurement and surface profile analysis, and is widely used in semiconductor processes, thin film materials, and microstructure analysis.

Analysis Application

Microstructure size measurement

Analyze the height and size characteristics of microstructures.

Surface Roughness Analysis

Perform a one-dimensional linear roughness (Roughness) analysis.

Deep Analysis

Can measure etching depth or structural depth.

Film Thickness Measurement

Measure the film thickness through step height.

One-dimensional surface profile measurement

Measure the height variation and contour curve of the sample surface.

Types of machines

high-precision surface profile and film thickness measurements. This equipment usesdiamond probescan the surface of the sample, establishing the sample by measuring the vertical displacement changes of the probe during the scanning process.One-dimensional surface profile。

When the probe crosses the step or structure of the sample surface, the sensor will record the height changes in real-time and convert them into signals, allowing for the analysis of the height differences, film thickness, and roughness of the material surface. The DektakXT has high resolution and long scanning distance capabilities, widely used insemiconductor processes, thin film materials, and microstructure measurement。

System Features

High PrecisionFilm Thickness (Step Height) Measurement
High-resolution surface profile measurement
Long-distance scanning capability
Applicable to semiconductor and thin film material analysis
Can measure microstructure height and depth.

System Measurement Capability

Item	Specifications
Maximum sample size	Display the echo time and intensity at a single location, providing interface depth and reflection characteristic data.
Maximum scanning length	Presenting the side view section along the linear direction allows for a clear determination of the defect's depth on the Z-axis.
Maximum measurement height (Z range)	Displaying the 2D defect distribution at a specific depth is the most commonly used mode for packaging quality inspection.