IC Packaging and Testing
IC packaging and testing are key stages after the chip completes wafer manufacturing. The purpose of packaging is not only to protect the chip but also to connect the chip to the system circuit board and complete the heat dissipation path design with stable electrical and mechanical strength through techniques such as redistribution layer (RDL), wire bonding or bump bonding, and underfill. As the integration and bandwidth requirements of chips increase, packaging is no longer a simple structural operation but a critical link that directly affects signal integrity, thermal management, reliability, and system performance.
In actual processing, factors such as packaging material properties, RDL and bump structures, interlayer thermal expansion differences, and soldering and reflow conditions can cause interface weakening, cracks, metal voids, or electrical shifts. These issues may arise at different stages during the early packaging, system assembly, and service life, thus requiring structural analysis and stress assessment to establish traceable judgment criteria.
MA-tek assists packaging and testing manufacturers in the processes of sample introduction, mass production scaling, packaging conversion, and customer complaint response by providing cross-sectional structure verification, packaging interface integrity analysis, post-packaging electrical change determination, and reliability lifetime assessment. Through high-resolution profile measurement and non-destructive testing, abnormal locations and formation mechanisms can be confirmed; through reliability testing, the stability of packaging components under temperature cycling, humidity load, and mechanical stress conditions can be predicted.
Application Examples
Applicable service items
| Service Categories | Common Problem Scenarios | MA-tek provides technology |
|---|---|---|
| Package structure cross-section analysis | Electrical anomalies after packaging, interface fragility, yield decline | FIB cross-section preparation, SEM / TEM / STEM, EDS material distribution analysis |
| Non-destructive packaging inspection | Customer complaint cases, packaging consistency confirmation, mass production sampling inspection | X-ray, XCT (3D X-ray), SAM, SAT |
| Evaluation of Packaging Stress and Thermal Behavior | High temperature/reflow anomalies, lifespan degradation | Thermal cycle test cross-section comparison before/after, thermal distribution / stress-related structural analysis |
| Post-packaging reliability verification (RA) | Automotive/Industrial Control/Consumer Electronics Product Life Assessment | TC, HAST, HTS, temperature reflow, Drop Test, Power Cycling |
| Comparison of packaging design/material differences | Risk confirmation during new package introduction or package transfer. | Comparison of structure before and after packaging, analysis of material property differences, design support recommendations |
Application of Multi-Detection Technologies in Packaging and Process Structure Analysis
The figure below shows the application scenarios of different detection and measurement technologies in packaging and process analysis: (a) Optical profile measurement (OP) presents the distribution of surface height and flatness, used to evaluate structural warping and morphological differences; (b) Observing surface micro-defects and structural details through scanning electron microscopy (SEM); (c) Examining the forming condition and consistency of metal lines (Metal fingers) on flexible circuit boards (FPC); (d) Conducting photo mask inspection to confirm pattern transfer and process quality. Through cross-comparison of multi-level images and measurement results, effective support can be provided for the interpretation and analysis of packaging structure and process anomalies.
(a) OP；(b) SEM；(c) Metal fingers formation on FPC ；(d) Photo mask inspection
Frequently Asked Questions
Q1. Why does the electrical property of the chip after packaging differ from that before packaging?
A. Thermal load, interface adhesion, and wiring layer stress during the packaging process can affect electrical performance.
Q2. Are there any voids or cracks inside the package, and how can this be confirmed?
A. Such defects may be hidden within the package and need to be inspected using non-destructive methods.
Q3. What could be the reasons for failure occurring after a period of use post-packaging?
A. Related to thermal cycling, material fatigue, or interface weakening.
Q4. How to reduce risks during packaging transfer (changing packaging factory / changing packaging materials)?
A. Need to compare the interface, material properties, and electrical differences before and after packaging.
Q5. Can packaging analysis be done with a small sample size?
A. Yes, the package cross-section and non-destructive inspection can be completed on a small number of samples.
