IC packaging and testing are key stages after the chip has completed wafer manufacturing. The purpose of packaging is not only to protect the chip but also to connect it to the system circuit board and complete the heat dissipation path design with stable electrical and mechanical strength through techniques such as redistribution layer (RDL), wire bonding or bump bonding, and underfill. As the integration and bandwidth requirements of chips increase, packaging is no longer a simple structural operation but a critical link that directly affects signal integrity, thermal management, reliability, and system performance. In actual processes, factors such as packaging material properties, RDL and bump structures, interlayer thermal expansion differences, soldering and reflow conditions, etc., can cause interface weakening, cracks, metal voids, or electrical shifts. These issues may arise at different stages during the initial packaging, system assembly, and lifespan, thus requiring structural analysis and stress assessment to establish traceable criteria. MA-tek assists packaging and testing factories in the processes of sample introduction, mass production scaling, packaging conversion, and customer complaint response by providing cross-sectional structure verification, packaging interface integrity analysis, post-packaging electrical change determination, and reliability lifespan assessment. Through high-resolution profile measurement and non-destructive testing, abnormal locations and formation mechanisms can be identified; through reliability testing, the stability of packaging components under temperature cycling, humidity loading, and mechanical stress conditions can be predicted.