PCB reliability testing
The printed circuit board (PCB/PWB) is the core foundational platform of electronic products, responsible for the electrical and structural integration of various electronic components. Compared to individual electronic components that can be replaced or repaired,Once a PCB malfunctions, it often requires the entire board to be scrapped, which has a significant impact on cost and delivery time.Therefore, its reliability requirements are no less than those of any semiconductor component.
PCB reliability testing is conducted through a series of standardized tests to verify the circuit board's performance inmanufacturing, assembly, reflow soldering, environmental stress, and long-term useUnder conditions, ensuring that the circuit board can still operate stably under harsh environments and long-term use is a key verification. MA-tek provides complete solutions from standard to automotive grade.
Printed circuit boards can be divided into rigid circuit boards (Rigid PCB), flexible circuit boards (Flexible PCB), and rigid-flex circuit boards (Rigid-flex PCB). Structurally, they can be classified as single-sided boards (Single-Sided PCB), double-sided boards (Double-Sided PCB), multilayer boards (Multilayer PCB), and high-density interconnection boards (HDI).
After decades of technological evolution,International Electronics Industry Alliance (IPC, Association Connecting Electronics Industries)已針對 PCB 的Electrical performance, material application, appearance quality, and reliability requirementsA complete standard system has been established, becoming a common language for global PCB manufacturing and verification. The IPC documents most commonly used in the industry include:
- IPC-A-600：Acceptability of Printed Boards
- IPC-6011：Generic Performance. Specification for. Printed Boards
- IPC-6012Qualification and. Performance Specification for Rigid Printed Boards.
- IPC-6013Qualification and. Performance Specification for Flexible Printed Boards
- IPC-6016：Qualification and Performance. Specification for High Density.Interconnect (HDI) Layers or Boards
- IPC-TM650：Test Methods Manual
With the rise of automotive electronics, 5G, AIoT, electric vehicles, and high-performance computing applications, PCBs need to operate stably for a long time under high temperatures, humidity, vibrations, and voltage fluctuations. Especially in the automotive market, manufacturers have extremely high reliability requirements and often customize testing specifications to ensure that products remain reliable in extreme environments. Therefore,Reliability testing has become a key threshold for PCB manufacturers to enter the high-end application market.。
MA-tek has long-term collaborations with many domestic and international PCB manufacturers, integrating material analysis and failure analysis technologies to provide compliance withIPC-TM-650multiple reliability tests according to customer-specific specifications, including:
-
Reflow Test:The new reflow oven meets the IPC TM-650 Method 2.6.27 standard, which can simulate the thermal stress of the soldering process and assess the thermal resistance of the PCB.
-
Electrochemical Migration Test:Provides 500V voltage testing capability, can conductSurface Insulation Resistance (SIR)與Conductive Anodic Filament (CAF)Testing the insulation reliability in a humid environment.
-
Via Reliability Test:Using a low-resistance dynamic measurement system (Datalogger) to monitor resistance changes over a long period, allowing for a more accurate assessment of the lifespan performance of through-holes under thermal cycling or stress.
