FIB circuit repair

FIB utilizes gallium (Ga, atomic number 31) as an ion source, using a negative electric field applied to the extractor to pull gallium atoms from the tip, forming a gallium ion beam. The ion beam is focused through an electric lens, and a series of variable apertures (Automatic Variable Aperture, AVA) can determine the size of the ion beam, which is then focused a second time onto the surface of the sample. Because gallium atoms are located in the middle of the periodic table, the removal effect caused by striking other elemental atoms is significantly greater than that of electrons, allowing for specific pattern processing on the surface of the sample using the ion beam.

General SB-FIB can provide functions such as material cutting, metal deposition, metal etching, and selective etching of oxide layers to meet the needs of circuit repair. With the help of gas-assisted etching systems, it can not only improve the etching selectivity and etching rate of different materials but also directly deposit specific materials. Currently, the auxiliary etching gases for MA-tek's SB-FIB machines can be applied to enhance the etching rates of polymers, metals (Al & Cu), and oxides. The types of auxiliary deposition gases include platinum (Pt), tungsten (W), and tetraethyl orthosilicate (TEOS). If SB-FIB is combined with a field emission scanning electron microscope (i.e., Dual Beam FIB, DB-FIB), real-time cross-sectional observation can be performed.

Circuit repair is an indispensable and increasingly important service in the IC design industry. Rapid turnaround speed and high construction yield are key to solving customers' IC design experimental issues. MA-tek currently has 15 Single Beam FIB (SB-FIB) microscopes available to provide IC circuit repair services, meeting the diverse needs of customers for product failure analysis. Coupled with professional skills and experienced personnel, we provide you with accurate, precise, efficient, and effective rapid analysis services for product failures.