LED Failure Analysis

In the research and development and mass production of LED components, if the product experiences issues such as brightness degradation, electrical abnormalities, or premature failure, it often requires a systematic failure analysis process to identify the true source of the problem. LED failures may arise from factors such as chip structural defects, packaging process anomalies, material degradation, or electrostatic damage. Therefore, it is necessary to combine various electrical measurement and localization techniques to accurately interpret the failure mechanisms.

Fault localization

Through photon emission or electrical localization techniques, abnormal areas in LED components can be quickly identified, assisting in the analysis of short circuits, leakage, or process defect locations, and serving as an important basis for subsequent structural analysis and failure interpretation.

Thermal imaging, infrared micro-light microscopy, laser beam resistance anomaly detection

EMMI/InGaAs, OBIRCH defect detection and localization

EMMI/InGaAs, OBIRCH in failure analysis applications