When a component experiences leakage, short circuit, or functional failure, the issue often arises from abnormal internal electrical distribution. Through high-resolution electrical analysis technology, it is possible to deeply analyze thecarrier distribution, doping concentration, and PN junction structure, effectively pinpointing the root cause of electrical failure.
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Application scenarios
- PN junction structure analysis
- Doping concentration distribution and depth profile analysis
- Electrical Abnormality (Leakage / Short) Localization
- Process deviation and component failure analysis
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Core Values
- High-resolution electrical distribution measurement capability
- can be integrated with FA (Failure Analysis) technology for application
- Significantly improve the efficiency and success rate of failure localization.