Optical communication and silicon photonics technology have become the key to high-speed, low-latency data transmission, and are widely used in fields such as data centers, HPC (high-performance computing), AI systems, 5G communication, autonomous driving, consumer electronics, and biomedical sensing.
Silicon photonic devices achieve higher bandwidth, lower power consumption, and higher integration at smaller sizes by integrating optical and electronic components on silicon chips. In particular, the introduction of Co-Packaged Optics (CPO) technology allows optical modules to be directly packaged with switching chips, shortening signal distances, reducing energy consumption, and enhancing overall system throughput.
However, the small size and complex interfaces of silicon photonic devices, as well as the alignment of optical paths, coating thickness, material stacking, and packaging stress, can affect insertion loss, signal distortion, and long-term stability.
MA-tek provides nano-scale structural profiling, optical film parameter measurement, and packaging thermal/stress behavior analysis, assisting customers in understanding the coupling relationship between optical path, materials, and packaging, supporting products from design verification, process optimization to reliability assessment.
| Service Direction | Focus points | Applicable scenarios | MA-tek assistance |
|---|---|---|---|
| Analysis of the interface between silicon waveguides and metal structures | Waveguides, couplers, metal junction structures and material differences | Optical losses, insufficient coupling efficiency | FIB-TEM + EDS cross-section and elemental distribution reconstruction |
| Evaluation of Optical Coating Thickness and Uniformity | Coating refractive index, thickness, uniformity | Signal attenuation, unstable reflection | XRR, Ellipsometry optical parameter measurement |
| Observation of Laser Module Junctions and Packaging Quality | reflective layer, mirror alignment, packaging deformation | Light spot displacement, light power reduction | IR imaging, 3DX-Ray, packaging cross-sectional analysis |
| Packaging warpage and stress behavior simulation | Thermal expansion differences, waveguide displacement | Long-term reliability and optical coupling stability | Warping/Stress Simulation, Structural Fatigue Assessment |
