ESD static electricity protection testing and design services

MA-tek provides fromComponent → Module → SystemThe complete ESD protection verification service provides customers with a one-stop electrostatic protection assessment, comprehensively enhancing the reliability and safety of products in real-world environments.

01

ESD testing

(HBM / CDM / MM / IEC)

02

Latch-up/High Temperature Latch-up

 

03

EOS testing

 

04

TLP/VF-TLP behavior analysis

 

05

Bonding and layout design

 

06

Failure analysis and improvement suggestions

 

MA-tek has complete ESD testing, Latch-up / high temperature Latch-up, EOS testing equipment and TLP / VF-TLP behavioral analysis, in compliance withMIL、JEDEC、ANSI、IEC、ISO、AEC-Qinternational standards, can providefrom component level to system levelComplete electrostatic discharge protection verification and technical consulting.

1. ESD Body Testing: HBM / MM / CDM

Electrostatic discharge can generate high current spikes in a very short time, so standardized models are needed to simulate discharge behaviors in different scenarios:

Non-socket CDM

CDMNowadays, samples are charged and discharged using electric fields, so testing does not require hardware, hence it is also calledNon-socket CDM(NCDM)supports any package

• Thermo Fisher Scientific Orion / Orion3

• Voltage range: ±25V ~ ±2000V (1V step)

• Orion3 equipped with a 6GHz oscilloscope, used for capturing high-speed discharge waveforms.

2.ICWill internal parasitic circuits be accidentally triggered?Latch-up /High temperatureLatch-up

ICWhen subjected to surges or noise, it may trigger unexpected activation of internal parasitic circuits, which can cause large currents to occur, ultimately leading toICOverheating damage, thereforeLatch-upAlthough not a ESDTesting body, but it isESDOne of the most important extended verifications in the process.

High Temperature Latch-up (HT-LU)

Automotive electronics and high-temperature applications are more likely to trigger parasitic conduction, so testing under high-temperature conditions is required.

• Equipment: Thermonics T-2600BV

• Testing Scope:+25°C ~ +150°C

• Standard fixtures can reach up to 125°C.

• Above 125°C, custom high-temperature fixtures are required.

• Automotive AEC-Q requirements must be met.HT-LUBecause the temperature of the car is very high, it is easier to trigger Latch-up.

3. Compared toESDGreater electrical over stress:EOS（Electrical Over Stress）

EOSis a common electrical over stress event on the system side, often associated withESDConfusion, but the two are different.EOSis a type of overvoltage/overcurrent event with a longer duration, affectingIChas greater destructive potential and is the most common source of failure in practical applications.

• Equipment: KAST KT-200SG

• Test range: ±5V ~ ±200V (0.1V steps)

EOS testing can effectively identify:

• IO overvoltage damage

• Thermal damage caused by high current on the system side

• Transient events caused by poor grounding and incorrect insertion/removal.

4. Automotive AEC-Q is a stricter version of ESD.

Automotive electronics have characteristics such as high temperature, high vibration, and long-term operation, therefore the reliability specifications of AEC-Q100/AEC-Q101 have stricter ESD requirements than general electronic products:

• HBMAll classes must be tested, skipping levels is not allowed.

• Latch-upNeed to perform "High Temperature Latch-up"

• CDMCorner Pin is a key verification item for automotive electronics.

AEC-Q emphasizesCompleteness, rigor, traceabilityis the core standard for ensuring the safety of automotive ICs.

5. Important tools for interpreting ESD performance and design strength: TLP / VF-TLP

TLP (Transmission Line Pulse) and VF-TLP (Very Fast TLP) are mainly used to analyze the I-V behavior of ESD protection circuits.

• TLPConstruct ESD models and analyze tolerance.

• VF-TLPSimulating high-speed transient events (such asCDM、IEC), suitable for advanced processes and high speedIO、RC clamp、SnapbackBehavior analysis.