ESD Static Electricity Protection Testing and Design Services

MA-tek provides fromComponent → Module → SystemComplete ESD protection verification services provide customers with a one-stop static protection assessment, comprehensively enhancing the reliability and safety of products in real-world environments.

01

ESD testing

(HBM / CDM / MM / IEC)

02

Latch-up/High Temperature Latch-up

 

03

EOS testing

 

04

TLP/VF-TLP behavior analysis

 

05

Bonding and layout design

 

06

Failure analysis and improvement recommendations

 

MA-tek has complete ESD testing, Latch-up / High Temperature Latch-up, EOS testing equipment, and TLP / VF-TLP behavior analysis, in compliance withMIL, JEDEC, ANSI, IEC, ISO, AEC-Qinternational standards, can providefrom component level to system levelComplete electrostatic discharge (ESD) protection verification and technical consultation.

1. ESD Body Testing: HBM / MM / CDM

Electrostatic discharge can generate high current surges in a very short time, thus requiring standardized models to simulate discharge behaviors in different scenarios:

Non-socket CDM

Non-socket CDM is an extension of CDM, applicable to ultra-small, high-density packages (CSP, WLP, micro BGA) that cannot use sockets.

• Thermo Scientific Orion / Orion3

• Voltage range: ±25V ~ ±2000V (1V step)

• Orion3 is equipped with a 6GHz oscilloscope for capturing high-speed discharge waveforms.

2. ESD may trigger parasitic conduction phenomena: Latch-up / High-temperature Latch-up

When ESD enters the IC, it may trigger the parasitic components of the CMOS structure to conduct erroneously, causingLatch-upThis phenomenon causes the current to continue flowing, ultimately leading to overheating and damage to the IC. Therefore, although latch-up is not the "main body of ESD testing", it is one of the most important extended verifications in the ESD process.

High Temperature Latch-up (HT-LU)

Automotive electronics and high-temperature applications are more likely to trigger parasitic conduction, so testing under high-temperature conditions is required.

• 設備：Thermonics T-2600BV

• Test range: -30°C ~ +225°C

• The standard fixture can reach 125°C.

• Above 125°C, custom high-temperature fixtures are required.

• Automotive electronics AEC-Q requirements must be met.HT-LUBecause the temperature of the car is very high, it is easier to trigger latch-up.

3. Voltage events greater than ESD: EOS (Electrical Over Stress)

EOS is a common overvoltage event at the system level, often confused with ESD, but the two are different. EOS is a longer-duration overvoltage/overcurrent event that is more damaging to ICs and is also the most common source of failure in practical applications.

• 設備：KAST KT-200SG

• Test range: ±5V ~ ±200V (0.1V steps)

EOS testing can effectively identify:

• IO overvoltage damage

• Thermal damage caused by high current on the system side

• Transient events caused by poor grounding and incorrect insertion/removal.

4. Automotive AEC-Q is a stricter version of ESD.

Automotive electronics have characteristics such as high temperature, high vibration, and long-term operation, therefore the reliability standards of AEC-Q100/AEC-Q101 have stricter ESD requirements than general electronic products.

• HBMAll classes must be tested, skipping levels is not allowed.

• Latch-upNeed to perform "High-Temperature Latch-up"

• CDMCorner Pin is a key verification item for automotive electronics.

AEC-Q emphasizesCompleteness, Stringency, Traceabilityis the core standard for ensuring the safety of automotive ICs.

5. Important tools for interpreting ESD performance and design strength: TLP / VF-TLP

TLP (Transmission Line Pulse) and VF-TLP (Very Fast TLP) are mainly used to analyze the I-V behavior of ESD protection circuits.

• TLPConstruct ESD models and analyze tolerance.

• VF-TLPSimulate high-speed transient events (such as IEC, CDE), applicable to advanced processes, high-speed IO, RC clamp, and Snapback behavior analysis.