Warp measurement
Accurately grasp micron-level warpage to enhance process stability and product reliability.In the field of advanced electronic packaging and semiconductor manufacturing, component warpage and surface deformation not only affect assembly quality but may also lead to long-term reliability risks. To assist customers in conducting high-precision warpage analysis, we have introduced industry-leadingAkrometrix AXP3 Shadow MoirThe system provides fast, non-contact three-dimensional deformation measurement services, fully supporting research and development, process monitoring, and quality verification needs.
Akrometrix AXP3Utilizing patentedTherMoiré®technology, combineShadow MoirThe optical interference method and automatic phase stepping technology can accurately measure the vertical displacement of samples under non-contact, full-field conditions.Out-of-Plane Displacementand fully record its deformation history during the thermal cycling process.
Main Measurement Capabilities
- Maximum sample size:400 mm x 400 mm
- Minimum sample size:2 mm x 2 mm
- Measurement resolution: up to500 nm (using a 300 LPI grating)
- Data point density:2obtained within seconds170ten thousand displacement data points
- Temperature range:-55°C to 350°C, supporting reflow simulation up to 280°C+
- Heating module: independent infrared heaters on top and bottom, with good temperature uniformity.
- Cooling efficiency: dual cooling systems and multi-channel exhaust system for rapid stabilization.
The main application areas are as follows:
- Electronic packaging warpage analysis (BGA、QFN、Socket, etc.)
- PCBmaterial thermal stress simulation andCTE calculation
- Reliability testing and failure analysis
- Design verification and material selection
- Complies with JEDEC、JEITA、IPCand other international standards
