Optical Film Thickness Measurement Instrument
a non-contact analysis technology that uses Optical Reflectance Spectroscopy to measure film thickness. The system uses a vertically incident light source to illuminate the sample surface. When the light enters the film structure, reflection and interference phenomena occur at different interfaces. The instrument detects the spectral changes of the reflected light and compares them with optical models to quickly obtain the thickness and optical parameters of the film. This technology has the advantages of being non-destructive, requiring no sample pre-treatment, and allowing for rapid measurements.Non-destructive, no sample pretreatment required, fast measurement speed and other advantages.
Principle of Optical Film Thickness Measurement
When the light source is vertically incident on the surface of the sample film, light will be generated between the film and the substrate interface.Reflection and transmission phenomenaSome light will be reflected at the surface of the film.reflected lightAnother part of the light penetrates the film to formtransmitted light。
Due to the certain thickness of the film, light will undergo multiple reflections between different interfaces and formOptical interference,Different thicknesses of films will cause specific changes in the intensity and spectral distribution of reflected light. The instrument detects the reflected light.Spectral intensity (%R)and combined with optical model calculations, the thickness of the film can be inferred.Thin film thickness,Multi-layer film structure information.
Filmetrics F40
can quickly measure the thickness and optical parameters of transparent or semi-transparent films. This system combinesMicroscopy optics and spectral reflectance techniquesBy analyzing the reflected light spectra of the film, the film thickness and optical constants can be calculated. During measurement with the Filmetrics F40, the light source illuminates the surface of the film, and the light reflects and interferes between different interfaces of the film. The instrument quickly calculates the film thickness by analyzing the changes in reflected light at different wavelengths. The system can be integrated with microscopes, reducing the measurement spot size to the micron scale, making it suitable for analyzing film thickness on microstructured areas or patterned samples.
System Features
-
Non-contact, non-destructive film measurement
-
Microscope integration allows for precise location targeting of measurement areas.
-
Micron-scale measurement spots (spot size - 120um under 10X lens)
-
Thickness measurements can be completed in seconds.
| Item | Specifications |
|---|---|
| Film thickness range | approximately 20 nm – 20 µm |
| minimum measurement light spot | Spot size - 120 µm under 10X lens |
| Measurement Method | Spectral Reflectance |
| Measurable materials | Transparent / Semi-transparent films |
-
Single-layer thin film thickness measurement (SiO2: 316.38 nm)
-
Multi-layer film thickness measurement (Si: 614.2nm / W: 54.63nm / Si3N4: 122.4nm)
