Mechanical Stress Test
Mechanical Stress Testis used to evaluate the electronic components under external forces, itsWhether the packaging structure, solder joints, and internal bonding have sufficient mechanical strength and durability,The test mainly simulates the components underduring the processes of assembly, testing, transportation, and actual useThe external mechanical stresses that may be encountered, such as thrust, tension, bending, vibration, and impact, help to identify potential structural weaknesses in advance, preventing functional failure due to mechanical damage. For semiconductor components, automotive electronics, and high-reliability applications, mechanical stress testing is a key verification process to ensure long-term stability and consistency of product quality.
MA-tek has the most complete in the industry.Component Reliability Testing Platform，涵蓋MIL-STD, JEDEC, IEC, JESD, AEC, EIAmultiple international standards, and provided by a senior engineering teamTotal Solutionto assist customers in completing the entire process of testing from experimental design, fixture development to result analysis. The main equipment includes:
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Wire Pull & Ball Shear testing machine
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Foot fatigue testing machine
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Universal Testing Machine
Through precise accelerometer calibration and measurement control, ensure the accuracy of each mechanical stress test.High accuracy of G value, high reproducibility, and reliable results.to assist customers in improving product reliability and quality trustworthiness.
Before conducting mechanical stress tests, it is necessary to confirm the components'SolderabilityWhether it meets the requirements, as most components need to be soldered onto the PCB board before proceeding with subsequent pull, bend, or vibration tests, the quality of the solder joints will directly affect the credibility of the mechanical test results. Solderability testing is usually based onJ-STD-002International standards implementation, common processes include:
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PreconditioningPre-treatment is used to simulate the actual soldering state of components after long-term storage, commonly adoptedCondition E high temperature baking (such as 155°C Dry Bake)to verify whether the solder surface still has sufficient solderability, avoiding the impact of oxidation or deterioration on subsequent mechanical testing judgments.
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Solderability TestIncluding the tin bath method, tin dipping method, and surface adhesion simulation method, among which the surface adhesion simulation method is closest to the actual SMT process, effectively assessing the wettability of solder joints and soldering quality, and is an important basic verification before mechanical stress testing.
Mechanical stress testing will select appropriate testing methods based on the component packaging type, size, and application context. Common items include:
Component and solder joint structure testing
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Heat Resistance TestConfirm the structural stability of the component in a high-temperature environment.
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Lead Fatigue TestEvaluate the durability of the pins under repeated bending.
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Push Strength Test / Peel Strength TestVerify the bonding strength between the solder joint and the pad.
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Pull Strength Test
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Wire Pull / Ball Shear TestConfirm the reliability of the internal bonding structure.
Special packaging structure testing
針對Cavity Package, bare packageProducts with relatively fragile structures (such as CMOS image sensors, MEMS components) often require additional testing as follows:
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Vibration Test
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Mechanical Shock Test
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Free Fall Test: Simulates the risk of dropping during transportation and packaging.
