Non-Destructive Analysis (NDA)又稱為Non-destructive testingis a type ofDetecting internal defects, structural integrity, and quality without damaging the sample or product.The technology, unlike traditional destructive analysis (such as cutting, grinding, and etching), emphasizes non-destructive analysis.Maintain sample integrityfor subsequent functional testing or comparative analysis, suitable for application inelectronic components, IC packaging, circuit boards, solder joints, metal structures and composite materialsand other fields.

The purpose of non-destructive analysis

• without damaging the product,Identify potential defects and failure signs

• Evaluate the quality and reliability of materials or structures

• Provide clues for subsequent failure analysis or reliability testing.

Applications of Non-Destructive Analysis

• Semiconductor chips and packaging (IC Package):Testing BGA solder joints, chip bonding layers, mold encapsulation bubbles, and interlayer delamination.

• Printed Circuit Board (PCB / PCBA):Evaluate soldering quality, short circuits, open circuits, and misalignment of inner leads.

• Materials and structural components:Detecting metal fatigue cracks and delamination of composite materials.

• Automotive electronics and aerospace components:Routine inspection and failure tracking for high reliability components.