Non-Destructive Analysis (NDA), also known as Non-destructive testing, is a type of Detecting internal defects, structural integrity, and quality without damaging the sample or product.the technology, unlike traditional destructive analysis (such as cutting, grinding, etching), non-destructive analysis emphasizesPreserve sample integrityfor subsequent functional testing or comparative analysis, suitable for application inelectronic components, IC packaging, circuit boards, solder joints, metal structures and composite materialsand other fields.

The purpose of non-destructive analysis

• without damaging the product,Identify potential defects and failure signs

• Evaluate the quality and reliability of materials or structures

• Provide clues for subsequent Failure Analysis or reliability testing.

Applications of Non-Destructive Analysis

• Semiconductor chips and packaging (IC Package):Inspect BGA solder joints, chip bonding layers, mold encapsulation bubbles, and interlayer delamination.

• Printed Circuit Board (PCB / PCBA):Testing soldering quality, short circuits, open circuits, and misalignment of inner leads.

• Materials and structural components:Detecting metal fatigue cracks and interlaminar separation of composite materials.

• Automotive electronics and aerospace components:Routine testing and failure tracking for high-reliability components.