SMT surface mount device adhesion technology services

Surface mount technology is a fundamental process in the electronics industry, aimed at combining various components with printed circuit boards (PCBs) to form a functional system. Throughout the entire process, the quality of solder joints, especially for IC components, is of greater importance, mainly due to the current high-density, high-pin-count IC components that are often packaged in ball grid arrays (BGA) or similar structures, such as wafer-level chip scale packages (WLCSP) or fan-out packaging technologies.

To quickly serve customers and provide stable product quality, MA-tek has established its own SMT experimental line, which includes equipment such as: Solder Paste Printer, SPI, Mounter, Reflow, and high-magnification optical microscope, to assist customers in board-level assembly services. The automatic inspection of solder paste volume helps control the quality of solder paste printing and automatically performs Cpk calculations to eliminate quality risks, improving the blind spots of traditional sampling measurements. The Mounter can provide design applications with a pin pitch of 0.25 mm, leading the domestic level. The Reflow can provide nitrogen and control the oxygen content, optimizing solder joint quality. In addition, for wafer-level products (WLCSP), it also offers customers underfill processing services.

Solderability Test

Using the SMT process for solderability testing has more practical significance than the traditional tinning method, and is closer to the SMT processing standards, especially for BGA type components. Testing method referenceJ-STD-002Specification, throughSMTSolder paste printing on ceramic boards and reflow can simulate whether solder balls are rejected or not.

 

MA-tek SMT is managed by experienced engineers, providing customers with a one-stop testing service to ensure sample consistency and high yield. It also offers DFM (Design For Manufacture) consulting and provides Consultant Service to thoroughly solve end quality issues for customers, meeting their diverse needs.

 

SMT vacuum reflow soldering service

Focus on solving component voids(Void)In response to the market trend for high reliability solder joint requirements, MA-tek provides advancedSMTThe vacuum reflow soldering service is designed for high power and high reliability electronic components, effectively reducing void rates and improving solder joint reliability. In MA-tek's rich experience in vacuum reflow soldering, voids are effectively reduced from>30% reduced to < 5%。

 

See technical article for details:https://www.matek.com/en/techarticle-detail/20250919/?tab=intro