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SMT Surface Mount Device Adhesive Technology Services

Surface mount technology is a fundamental process in the electronics industry, aimed at combining various components with printed circuit boards (PCBs) to form a functional system. Throughout the entire process, the quality of solder joints for IC components is particularly emphasized, mainly because high-density, high-pin-count IC components are often packaged using ball grid array (BGA) or similar structures, such as wafer-level chip scale packaging (WLCSP) or fan-out packaging technology.

 

What is SMT surface mount device adhesion technology?

Surface mount technology is a fundamental process in the electronics industry, aimed at combining various components with printed circuit boards (PCBs) to form a functional system. Throughout the entire process, the quality of solder joints, especially for IC components, is of greater concern, primarily due to the current high-density, high-pin-count IC components that are mostly packaged in ball grid array (BGA) or similar structures, such as wafer-level chip-scale packages (WLCSP) or fan-out packaging technologies.

 

To quickly serve customers and provide stable product quality, MA-tek has established its own SMT experimental line, which includes equipment such as: Solder Paste Printer, SPI, Mounter, Reflow, and high-magnification optical microscope, to assist customers in board-level assembly services. The automatic inspection of solder paste quantity helps control the quality of solder paste printing and automatically performs Cpk calculations to eliminate quality risks and improve the blind spots of traditional sampling measurements. The Mounter can provide applications for a pitch of 0.25 mm, leading the domestic standards. The Reflow can provide nitrogen and control the oxygen content, optimizing the quality of solder joints. In addition, for wafer-level products (WLCSP), it also offers customers underfill processing services.RA1-6-1_SMT process-0

 

Solderability Test

Using the SMT process for solderability testing is more practical than the traditional tinning method and is closer to SMT processing standards, especially for BGA components. Currently, there is no standard method for testing, but through SMT solder paste printing on ceramic boards and reflow, it can simulate whether the solder balls will wet or not, making it one of the more accepted methods.
 
MA-tek SMT is managed by experienced engineers, providing customers with a one-stop testing service to ensure the consistency and high yield of samples. It also offers DFM (Design For Manufacture) consulting and provides Consultant Services to thoroughly solve end quality issues for customers, meeting their diverse needs.
 

 

Q&A
Q1. What is the smallest stencil pitch that can be achieved?
A. The thickness of the steel plate mainly uses 0.04 & 0.06 & 0.08mm, currently opened to 0.25 pitch.
Q2. What model of solder paste is mainly used?
A. The laboratory mainly uses solder paste from the manufacturer SMIC, model: M705-GRN360-K2-V.
Q3. What is the alignment accuracy of the placement machine? What is the minimum pitch that can be produced?
A. Laser accuracy 0.05; image identification 0.04mm, equipment specifications can produce 0.25 pitch.
Q4. Can the reflow control the oxygen content? What is the maximum ppm?
A. The reflow equipment can control the oxygen content, keeping it below 500ppm.
Q5. Can you provide flux clean operation?
A. Universal fixtures can be used to provide Flux clean services for different PCB sizes.
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Taiwan Laboratory | Silicon Conductor

Mr. Chu

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01.16
2026
This seminar is themed "Silicon Exploration of the Future: The Intelligence Quest of AI × Silicon Photonics," emphasizing how the integration of AI, high-speed computing, silicon photonics, and advanced packaging technology redefines computing efficiency. The concept of "Intelligence Quest" symbolizes the identification and analysis of the best opportunities for future technological development through these key technologies.
For more information: https://www.matek.com/zh-TW/Seminar/detail/all/20250327
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