SMT Surface Mount Device Adhesive Technology Services
Surface mount technology is a fundamental process in the electronics industry, aimed at combining various components with printed circuit boards (PCBs) to form a functional system. Throughout the entire process, the quality of solder joints for IC components is particularly emphasized, mainly because high-density, high-pin-count IC components are often packaged using ball grid array (BGA) or similar structures, such as wafer-level chip scale packaging (WLCSP) or fan-out packaging technology.
Surface mount technology is a fundamental process in the electronics industry, aimed at combining various components with printed circuit boards (PCBs) to form a functional system. Throughout the entire process, the quality of solder joints, especially for IC components, is of greater concern, primarily due to the current high-density, high-pin-count IC components that are mostly packaged in ball grid array (BGA) or similar structures, such as wafer-level chip-scale packages (WLCSP) or fan-out packaging technologies.
To quickly serve customers and provide stable product quality, MA-tek has established its own SMT experimental line, which includes equipment such as: Solder Paste Printer, SPI, Mounter, Reflow, and high-magnification optical microscope, to assist customers in board-level assembly services. The automatic inspection of solder paste quantity helps control the quality of solder paste printing and automatically performs Cpk calculations to eliminate quality risks and improve the blind spots of traditional sampling measurements. The Mounter can provide applications for a pitch of 0.25 mm, leading the domestic standards. The Reflow can provide nitrogen and control the oxygen content, optimizing the quality of solder joints. In addition, for wafer-level products (WLCSP), it also offers customers underfill processing services.

Solderability Test