SEM-based Nano-probing
Under the rapid development of high-performance computing and AI chips, the semiconductor process has officially entered the post-Moore era. The process node has advanced from 7nm to 5nm, and is progressing towards 3nm and 2nm; the component structure has also evolved from planar MOSFET toFinFET and GAAand other three-dimensional structures.
At this nanoscale, traditional AFM-based nano-probing has become difficult to meet the demands for high-resolution positioning and stable electrical measurements.SEM-based Nano-probing (Scanning Electron Microscope Nano-probing Technology)Become the core tool for advanced process single device measurement and failure analysis.
SEM-based Nano-probing can be conducted in a SEM vacuum environment, usingLow acceleration voltage electron beamSuccessfully applied in conjunction with nano-probing.5nm FinFET process node。
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High-resolution morphology observation
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Single Transistor I-V / C-V Measurement
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Leakage and short circuit localization
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RC delay analysis
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EBIC / EBAC / EBIRCH failure interpretation
SEM-based Nano-probing is to combineScanning Electron Microscope (SEM)Integrating with a nano-scale mechanical probing system in the same vacuum environment allows engineers to perform electrical measurements and defect localization of individual transistors synchronously under high-resolution imaging conditions.
On the SEM platform, in addition to basic electrical measurements, electron beam induced analysis can also be performed. When the electron beam strikes the sample, electron-hole pairs are generated, which can form measurable current signals, thereby locating defects such as gate oxide breakdown, junction leakage, or metal open and short circuits. By cross-referencing EBIC, EBAC, and EBIRCH techniques, different types of failures can be distinguished, enhancing the accuracy of interpretation.
In advanced processes below 5nm, a single technology can no longer fully determine the root cause of failure.MA-tekWith "cross-technology integration" as the core advantage, SEM-based Nano-probing is incorporated into the complete failure analysis process, rather than being a point measurement.
MA-tekIntegrating SEM-based Nano-probing into the complete failure analysis process, rather than as a standalone measurement technique. Once the nano probe locates a suspicious area, it can seamlessly connect with AFM-based Nano-probing, C-AFM, OBIRCH, Thermal EMMI, FIB precise sample preparation, and TEM structural verification, forming an integrated platform for Electrical FA and Physical FA.
At nodes of 5nm and below, a single technology has become insufficient to solve complex failure issues. Through cross-technology validation and professional interpretation experience, MA-tek can effectively shorten positioning time, improve the success rate of root cause determination, and reduce rework and misjudgment risks.
The nProber IV fourth-generation SEM-based NanoProber system integrates high-resolution SEM and nano-probing measurement platforms, allowing for single transistor electrical measurements and precise failure localization in a vacuum environment, making it a core device for advanced process nano-electrical analysis.