IC Decap is a specific technology used to remove the encapsulation of integrated circuits (IC) in order to expose the internal structures.Epoxy molding compoundThe sample preparation technology that removes the encapsulation to expose the die, bond wire, and internal structure is commonly applied inFailure Analysis (FA), packaging reliability testing and circuit reverse engineering. and other fields.

In packaged ICs, the main function of the packaging resin is to protect the die from external environmental influences and provide mechanical strength. However, when it is necessary to analyze the internal structure of the component or locate the fault position, the packaging material hinders microscopic observation. Therefore, decapsulation treatment must be performed first to expose the die and internal connection structures for subsequent analysis. After IC decapsulation, engineers can use various microscopic analysis techniques to observe the internal structure of the component, such as:

• Optical Microscope (OM)

• Scanning Electron Microscope (SEM)

• Focused Ion Beam Analysis (FIB)

• Transmission Electron Microscope (TEM)

The currently common IC decapsulation methods mainly includeChemical Decapsulation and Laser Decapsulation,Different technologies have their applicable situations and advantages. Engineers usually choose the most suitable decapsulation method based on the type of packaging material, analysis requirements, and component structure. Through appropriate decapsulation techniques, not only can the grain and gold wire structures be completely preserved, but it can also effectively enhance subsequent.Failure analysis, packaging structure inspection, and circuit analysis accuracy.