IC packaging wire bonding service

Wire bonding is a key process for establishing electrical connections between the die and the package pins. Depending on the wire material and process method, it can be mainly divided into two types of wire bonding:

Figure | (a) Ball bonding (gold wire & copper wire) (b) Wedge bonding (aluminum wire)

By precisely controlling the welding temperature, pressure, and ultrasonic energy, good conductivity and mechanical strength of the solder joint can be ensured.

Wire bonding technology is widely used in:

• Chip-on-board (COB)

• Die stacking packaging

• PCB chip-on-board connection

• High pin count IC packaging

• COF / COG display components re-soldering

Diagram | Wire Bonding Process Schematic

The wire bonding process involves the formation of the ball bond, the first bond, the formation of the wire arc, and the completion of the second bond, establishing the electrical connection between the die and the package. The precise bonding from the formation of the ball bond to the completion of the second bond typically includes the following steps:

1. Free Air Ball formation:Metal balls are formed through arc discharge.

2. 1st Bond: Join the metal ball to the chip solder pad.

3. Looping (arc formation):Control the wire height and arc shape.

4. 2nd Bond: Solder wire bonding to the package pins or substrate.

MA-tek not only provides packaging and wire bonding services, but also integrates complete material analysis and failure analysis capabilities, offering integrated services for semiconductor research and development as well as problem resolution. Through the integration of comprehensive packaging and analysis technologies, MA-tek can assist customers in accelerating product development and problem diagnosis, providing highly efficient and reliable semiconductor technology services.

1. High precision fine pitch wire bonding capability (22 μm pitch)

2. Support for various wire materials and packaging forms

3. Provides flexible packaging service delivery, supporting R&D projects and urgent testing needs.

   • Regular items: 5 working days

   • Urgent: 3 working days

   • Urgent items: 1 working day

4. Packaging, analysis, and reliability testing integrated services

Important support for packaging development, reliability verification, and failure analysis, MA-tek's IC packaging and wire bonding services can support various research and analysis needs, including:

Image | Aluminum wire bonding at 50um pitch (linear)

As the number of pins in semiconductor packaging continues to increase and the pad pitch keeps shrinking, high-precision wire bonding technology has become an important capability in packaging research and development. MA-tek possesses high-density IC packaging and fine pitch wire bonding capabilities:

• Minimum pitch of gold wire:22 μm

• Gold wire diameter:0.5 mil

• Aluminum wire pitch:50 μm

 

 

 

MA-tek can provide variousChip-on-Board (COB)Packaging design, including

Image | Chip-on-Board (COB) packaging example

COB packaging can directly encapsulate chips onto the substrate, suitable for R&D testing and high pin count packaging applications. MA-tek supports various Chip-on-Board packaging types and can provide multiple options.Chip-on-Board (COB)Packaging design, including:

• COB 48L

• COB 64L

• COB 256L

• COB 400L

• COB materials can be selected as back-side & front-side or with and without bonding.

In addition to COB packaging, MA-tek can also provide various types of ceramic packaging, which can be selected based on the customer's testing requirements:

Diagram | Schematic of packaging cover forms, different packaging covers can be selected based on testing requirements and environmental conditions.

MA-tek provides various chip protection methods, and different cover forms can be chosen after packaging is completed:

• Epoxy Encapsulation

• Glass Lid

• Metal Lid

• Plastic Lid