Chat with us, powered by LiveChat

SCM scanning capacitance microscope

Technical Principles

Scanning Capacitance Microscopy,SCM) is a technology based on Scanning Probe Microscope (SPM)semiconductor analysis technology, that can be used to observe the 2D Doping Distributionand can clearly distinguishN-type and P-type regions

 

During the measurement process, an alternating current voltage (AC bias) is applied between the metal-coated probe and the sample to measure the capacitance change signal.dC/dVand convert the signal into the doping distribution image of the material. Through this method, the semiconductor structure can be obtained.P-N junction position and doping distribution.Since SCM is based on the structure of scanning probe microscopy, itsThe planar resolution can reach approximately 100 nm or more.suitable for analyzing the structure of semiconductor devices at the nanoscale.

 

Compared to other analytical techniques, SCM can provideHigh-resolution two-dimensional doping images, and therefore in Process analysis, failure analysis, and reverse engineeringhas important value.

  • SIMS and SRPCan only provide one-dimensional doping depth distribution.

  • SEM combined with chemical etching stainingIt is more difficult to precisely control the etching conditions.

 

Scanning Capacitance MicroscopeMainly used for the observation and analysis of two-dimensional carrier concentration images.

The scanning capacitance microscope is built on the structure of a scanning probe microscope, allowing for a planar resolution of over 100 nanometers. During analysis, an AC voltage is applied to the metal-coated probe, measuring the dC/dV signal which is converted into a two-dimensional doping distribution, enabling the distinction between N-type and P-type regions and their interfaces.
Analysis Application
Reverse Engineering Analysis
Obtain the two-dimensional doping distribution image of the component, applied to IC structure analysis and reverse engineering analysis.
P-N junction distribution analysis
Observe the position and morphology distribution of the P-N junction in the component.
N-type and P-type doping analysis
Identify the N-type and P-type regions in the semiconductor structure.
Types of machines

Bruker Icon

BrukerIconScanning Probe Microscope can perform high-resolution semiconductor doping distribution analysis.The system scans the sample surface using a conductive probe and measuresdC/dV (capacitance change with voltage) signalcan obtain semiconductor materialstwo-dimensional doping distribution image, and clearly identify N-type and P-type regions and their junction positionsSuitable for analyzing the doping structure and junction distribution in advanced semiconductor devices. This equipment is commonly used in:

 

  • semiconductorP-N junction analysis

  • Two-dimensional doping distribution observation

  • Process defect and leakage analysis

  • IC structure reverse engineering analysis

Application Examples

SCM two-dimensional doping distribution image

(a) SCM imaging shows the doping distribution in different regions of semiconductor devices. By measuring the dC/dV signal and converting it into images, the N-type and P-type doping regions and their junction positions within the device can be clearly observed, presenting a nanoscale two-dimensional doping structure.

(b) SCM measurement result images and signal distribution. The color scale represents variations in capacitance signals (dC/dV), corresponding to different doping types and concentration distributions in the material, which can be used to analyze P-N junction morphology, doping uniformity, and areas of process anomalies.

Trench structure doping distribution

This image isScanning Capacitance Microscopy (SCM) measurements obtained trench structure planar doping distribution images.Through measurementdC/dV signaland converted into images, presenting different areas of the component surface.Doping types and distribution conditions

The grayscale in the image corresponds to the doping types of the materials, among which:

  • bright areas represents P-type doping region

  • dark areas represents N-type doping region

The high-resolution two-dimensional doping images from SCM allow for clear observation.Doping distribution around the trench structure and junction morphologyhelps in analyzing component structure design, process uniformity, and potential defects.

This analysis technique is commonly applied to:

  • Advanced semiconductor device doping distribution analysis

  • P-N junction structure observation

  • Analysis of process anomalies or leakage issues

  • IC structure reverse engineering analysis

 
 
Contact
Contact Window
Taiwan Laboratory

Mr. Liu

Ext. +886-3-6116678 ext:3972
Shanghai Laboratory

Mr. Yang

Ext. +86-21-5079-3616 ext:7201

Privacy Preference Center

We use cookies to allow our website to function properly, personalize content and advertisements, provide social media features, and analyze traffic. We also share information about your usage of our website with social media, advertising, and analytics partners.

View Privacy Policy

Manage Consent Settings

Necessary Cookies

Always Enabled

The operation of the website relies on these cookies, and you cannot disable them in the system. These cookies are usually set based on the actions you take (i.e., service requests), such as setting privacy preferences, logging in, or filling out forms. You can configure your browser to block or prompt you about these cookies, but this may result in certain website functionalities not working.