An integrated circuit (IC) integrates a large number of electronic components (such as transistors, resistors, capacitors, etc.) onto a silicon substrate through miniaturization and layout techniques, allowing the chip to perform high-speed computing, data processing, or control functions in a very small area.
IC design is the process of establishing circuit architecture, logical behavior, and physical layout based on product functionality, performance requirements, power consumption targets, and process specifications, ultimately outputting design files (such as GDS) that can be used for wafer manufacturing. As semiconductor processes advance to 7nm, 5nm, 3nm, and more advanced nodes, along with the rapid maturation of heterogeneous integration, Chiplet, 2.5D/3D IC, and advanced packaging technologies, the scope of IC design is no longer limited to the circuit logic itself, but must also consider:
1. Process feasibility of materials and structures
2. Stacking of metal layers, dielectric layers, and wiring density
3. Signal Integrity (SI), Power Integrity (PI), and Thermal Design
4. The impact of packaging and system integration on performance and lifespan
5. Long-term reliability and performance degradation under operating environment
Therefore, IC design needs to achieve a balance between performance, power consumption, size, cost, and reliability, and ensure that the chip can maintain the expected electrical characteristics and operational behavior after entering manufacturing and packaging.
Application Examples
| Service Categories | Analysis/Test | Can confirm/Can locate content | MA-tek provides technology |
|---|---|---|---|
| Material and Structural Analysis (MA) | Verify whether the chip structure meets design and process requirements. | metal layer thickness, dielectric layer morphology, wiring density, via/contact structure, interface quality | TEM, STEM, FIB, SEM, EDS, EELS |
|
Failure Analysis （FA） |
Identify the sources of open circuit, short circuit, or abnormal electrical characteristics. | via void, crack, metal migration, electrical leakage, interface separation, stress effects caused by packaging | OBIRCH、TIVA、X-ray、SAM、Decap、Passive Probe |
|
Reliability verification (RA) |
Evaluate the lifespan and stability of chips in the usage environment. | metal migration, dielectric layer breakdown, thermal aging, mechanical fatigue, packaging thermal stress effects | HTOL, EM, TDDB, BTI, TC, HAST, HTS |
