Reliability Analysis

The packaging must withstand temperature and mechanical stress tests in the actual operating environment. Through reliability analysis, the stability of the packaging under long-term operating conditions can be assessed, thereby reducing potential failure risks.

Case study of bump failure after reliability testing

This case study analyzes the failure of bumps in a product after reliability testing. Using FIB cutting and multi-scale microscopy, the structural changes at the failure site were observed.

(a) Optical microscopy (OM) images after FIB cutting, used to confirm the location of failure areas.

(b) FIB cross-sectional analysis, observing the internal structure and interface status of the bumps.

(c) Transmission Electron Microscopy (TEM) imaging, further analyzing material and defect characteristics at the micro level.

Abnormal high resistance issue of bumps

The analysis results indicate that the bump structure experiences interface degradation under reliability stress, leading to obstruction of the conduction path and subsequently causing abnormal resistance increase. If such issues are not detected early, they may affect the long-term reliability and production stability of the product. Through precise cross-sectional analysis and high-resolution image comparison, it can effectively assist customers in clarifying failure mechanisms, serving as an important basis for subsequent process optimization and design improvements.