EBSD Electron Backscatter Diffraction
EBSD is a technique that uses backscattered electron diffraction to identify the crystallographic orientations of samples. In the semiconductor industry, this technique is often used to study the microstructure of materials. The EBSD probe device is located in a focused ion beam (FIB) microscope, where the sample surface is tilted at an angle of about 70 degrees to the direction of the electron beam. When the electron beam strikes the sample, it generates backscattered electrons that produce diffraction patterns as they pass through the surface crystal structure, forming Kikuchi lines and Kikuchi patterns. This information, which carries the orientation of the surface grains of the sample, enters the detector to determine the orientation of each individual grain.
After knowing the diffraction state at each position on the sample surface and the orientation of each grain, this information can be used to further analyze grain boundaries, grain orientations, textures, and strains. It can also be combined with EDX for collaborative analysis, conducting phase identification and distribution analysis.
MA-tek hasAdvanced FIB-SEM and EBSD system integration platformcan accurately measure nanometer-level grain structures and combineEDX, TEM, SIMSand multiple analysis techniques to provide customers with comprehensive microstructural analysis and failure root cause determination, assisting in improving product reliability and process yield.
By analyzing the diffraction signals from various points on the surface of the sample, EBSD can further analyze the following structural features:
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Grain Boundary AnalysisDetermine the type and angle difference of grain boundaries.
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Grain OrientationDraw the grain orientation distribution map to reveal the crystal arrangement direction.
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Texture analysisUnderstand the crystal arrangement tendency of materials during the forming process.
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Strain distributionDetecting the internal stress concentration and deformation state of materials.
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Phase Identification & Distributionto matchEDX energy dispersive spectroscopy analysiscan identify the chemical composition and distribution of different phases.
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EBSD application fields
EBSD technology is widely applied insemiconductors, electronic materials, metals, ceramics, and advanced packagingIn the industry, especially inGrain structure observation, reliability failure analysis, and process optimizationPlay a key role.
EBSD applications include:
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Substructure Analysis
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Grain Size / Boundary Characterization
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Grain Orientation & Texture Analysis
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Phase Identification & Distribution Mapping
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Analysis of Material Deformation and Recrystallization Behavior (Deformation & Recrystallization Study)
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Strain & Stress Distribution
EBSD application examples
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Orientation Map
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Phase Map
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Grain size distribution
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Misotientation angle distribution
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Pole figure
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Inverse pole figure
