3D OM Optical Microscope
3D OM optical microscope utilizes principles such as optical interference, focus variation, or white light interference to obtain sample information in a non-destructive manner.stereoscopic height information (Z-axis)and present simultaneouslyHigh-resolution 2D × 3D structural imagesCompared to OM, which can only provide "flat images," 3D OM can display the completesurface profile, roughness, depth differences, defect volume and geometric measurementIt is an advanced imaging technology that is extremely valuable in semiconductor, electronic packaging, and materials engineering.
MA-tek's 3D OM optical microscope system supports real-time 3D image capture, depth stacking, high dynamic range (HDR) imaging, and multi-angle observation, fully covering fromMicron to nanometer level height difference measurementRapid defect diagnosis and complex geometric measurement。
- Three-axis automated 3D imaging:Through Z-axis micro-displacement scanning combined with image algorithms, it can automatically construct a 3D model of the sample, suitable for packaging, height control processes, MEMS, metal materials, and other fields.
- Real-time 3D Profile and multimodal geometric measurement:3D OM can perform various geometric measurements and has traceability and repeatability, making it a highly useful technology for quality control and process engineering.
- Multi-angle real-time imaging:The 3D OM can capture the observation area from different angles through a variable angle optical path or an inclined sample stage, which is extremely advantageous for judging surface cracks, three-dimensional edges, and stacked structures.
- HDR (High Dynamic Range) high dynamic range imaging:In semiconductor and packaging processes, high-reflective metals (Cu, Al, Au) and low-reflective materials (resin, IMD) often coexist. Traditional OM is prone to metal overexposure or resin underexposure, while the HDR technology of 3D OM can simultaneously retain the details of materials with different reflectivity.
- 50–5000X ultra-wide magnification range:
| magnification | engineering applications |
|---|---|
| 50–200X | Appearance, packaging defects, wire bonding area observation |
| 200–1000X | solder joint surface, dielectric layer cracks, etching morphology |
| 1000–5000X |
Micro-machining structures, roughness measurement, MEMS features
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3D OM technology transforms structures that could only be described in two dimensions into three-dimensional models with height information, allowing all process and structural details to be fully quantified, making it an essential technology for many engineering analyses.
1. IC Die Size and Packaging Appearance Measurement
3D OM can accurately observe the shape, edge quality, thickness, and cutting consistency of the die, while also measuring issues such as warping, sinking, resin surface fluctuations, and structural tilt of the packaging appearance. This information can be used for cutting process verification, packaging defect assessment, or appearance quality analysis after molding.
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Die length/width/thickness
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Edge trimming consistency
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Chip corner damage
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RDL thickness and height distribution
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Bond pad deformation
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Die attach resin height
2. Solder joints and metal surface 3D structure
3D OM can reconstruct the complete three-dimensional morphology of solder joints, including solder ball diameter, height, volume, and wetting angle. It can even present the apparent roughness of the IMC surface and the surface waveform after reflow. 3D OM can provide both morphology and height simultaneously, making it particularly suitable for inspecting the consistency of solder joint appearance and height in PCBA, WLP, Fan-out, and high-density packaging.
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Solder ball diameter / height
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Bump / Pillar height difference
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Wetting behavior
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Voids external morphology
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IMC intermetallic compound surface roughness
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Post-reflow surface unevenness
3. Packaging and substrate process monitoring
3D OM provides highly repeatable and traceable measurement data for variations in RDL line thickness, Cu pillar top flatness, solder mask thickness differences, bump coplanarity, and package warpage. It is suitable for advanced packaging processes such as Flip-chip, WLP, Fan-out, and 2.5D/3D IC, enabling process engineers to quickly assess batch differences and process anomalies, which is critical for product quality control.
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Cu pillar top flatness (Topography)
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RDL Trace thickness difference
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Solder mask thickness
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Bump coplanarity
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Package warpage
4. Material Surface Analysis and Process Morphology
3D OM can accurately reveal information such as etching depth, film undulation, micropore shape, crack depth, and surface roughness. Due to its non-destructive characteristics, it can be directly applied to the analysis of metals, ceramics, glass, polymers, composite materials, and MEMS microstructures, making it the most efficient three-dimensional measurement method in materials science and process development.
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Roughness Ra / Rq calculation
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Coating uniformity verification
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Etching depth measurement
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Differences in film thickness appearance
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Determination of Micropore Volume
