Surface & Film Analysis
In semiconductor and advanced packaging processes, surface morphology and film thickness directly affect product performance and reliability. Through high-resolution surface measurement technology, it can accurately assess the materials'surface roughness, structural morphology, film thickness uniformity and process quality。
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Application scenarios
- Thin Film Thickness Measurement and Process Monitoring
- Surface roughness (Roughness) analysis
- Microstructure and Nano Morphology Observation
- Etching, deposition, and CMP process quality assessment
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Core value
- nanometer-level resolution capability
- Non-destructive measurement, improving sample preservation integrity
- Rapid measurement and real-time feedback on the process
