Mechanical Stress Test
Mechanical Stress Testis to simulate the external forces and impacts that products may encounter during transportation, handling, and actual use, includingDrop Test, Compression, Vibration, Push / Pull, Mechanical Shock等。
When external forces act on a product, its tolerance not only affects the final quality but also directly determines the consumer's usage experience, brand trust, and even relates to the company's manufacturing costs and after-sales repair rates.
As electronic products continue to develop towards smaller, thinner, and lighter designs, the bonding area between electronic components and PCBs continues to shrink. Additionally, the fatigue performance of lead-free solder is inferior to that of traditional leaded materials, making the overall structural durability more challenging. Therefore,The verification frequency of various assemblies and component structures has significantly increased, making mechanical stress testing an indispensable method for reliability confirmation.By conducting mechanical stress tests on finished or semi-finished products, it is possible to quickly identify:
- Weak points in structural design
- Is the assembly quality stable?
- Are there potential risks in the assembly of IC solder joints, BGA, CSP, etc.?.
- Will it fail due to transportation vibration or dropping?
Especially for handheld products or mobile devices, the most common cause of failure during use isdrop or impactTherefore, the Mechanical Shock Test is usually the most critical verification item in the development process.
Vibration Test
Products may encounter prolonged shaking, collisions, or vibrations during transportation, therefore vibration testing is one of the most important items in mechanical stress verification. Common methods include:
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Random Vibration:The closest to the real transportation environment, it can verify the structural strength and reliability of the product.
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Sine Vibration:Used to evaluate the resonance and fatigue behavior of products at specific frequencies.
When vibration interacts with temperature and humidity, the impact on product durability is greater, so many industries adoptCombined Stress Test例如：MIL-HDBKReliability Design ManualIt is pointed out that vibration and temperature are the primary factors causing product failure.ISO 16750 (Automotive Standard)A combined test mode of "temperature cycling + vibration" is also required.
Mechanical Shock Test
Simulating sudden external forces, such as drops and impacts, can quickly expose potential issues with the shell structure, screw fixation, and weld point strength.
Drop Test
The most common reliability tests for handheld devices are used to assess whether the casing cracks, whether the PCBA detaches or deforms, and whether there are hidden cracks in components such as BGA and CSP after dropping from different heights.
Combined Stress Test
Applying "vibration + temperature / humidity" simultaneously is closer to the real usage environment, simulating scenarios such as automotive electronics operating on bumpy roads and in high-temperature environments, and industrial control equipment functioning on vibrating platforms. Such tests can reveal deeper potential risks compared to single stress tests.
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Vibration and Impact Types
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Vibration Test
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Combo Vibration Test
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Mechanical Shock Test
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Drop and transportation simulation
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Drop Test
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Tumble Test
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Structural strength testing
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Compression Test
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Bending Test / Press Test
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Press Test
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Torque Test
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Strain and weld point inspection
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Strain Measurement
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Dye and Pry Test
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After completing tests such as vibration, drop, and impact, engineers often need to check whether the solder joints have developed cracks or delamination due to external forces. At this time, the red ink test can be used to penetrate the cracks and reveal the issues after delamination, allowing for a complete observation of the integrity of BGA, CSP, QFN, various types of package solder joints, and PCBA structures. Compared to cross-section analysis, which only shows localized sections, red ink can observe problems from a "surface" perspective, making it more suitable for rapid reliability assessments of large samples.
