Electrical Failure Analysis
Electrical Failure Analysis (EFA) is one of the core analytical methods in semiconductor failure analysis, primarily used to determine the abnormal behavior of chips or electronic components during electrical measurements and further locate the failure area to clarify its root cause. Under advanced processes and highly integrated IC architectures, electrical anomalies often arise from the interactive effects of design conditions, process variations, material defects, or operational stresses. Through a systematic electrical failure analysis process, the failure range can be effectively narrowed down, supporting subsequent structural, material, and reliability analyses.
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The chip cannot start normally or has functional abnormalities.
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Leakage current abnormal high
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Short or Open issues
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Electrostatic Discharge (ESD) or Overvoltage Stress (EOS) damage
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Latch-up, overcurrent or electrical instability behavior
- Electrical anomaly localization and failure area confirmation
- Short Circuit/Open Circuit Failure Analysis
- Leakage Current and Electrical Degradation Analysis
- ESD/EOS failure identification
- Design and process interaction impact analysis
