Component Level Reliability Serviceis used to verify the power semiconductor components under long-term, high-stress operating conditions, theirWhether the electrical properties, structure, and materials can maintain stable and safe operation.a series of testing processes, the tests mainly focus onIGBT, MOSFETHigh power components, simulating the conditions they may encounter in actual applications.High temperature, high humidity, high voltage, high current, frequent switching, and mechanical stressIn harsh environments, potential failure risks can be identified early.

The main purposes of component reliability testing can be summarized in three points:

1. Verification of design and process stabilityConfirm whether the chip or package design can withstand the stresses of the actual operating environment.

2. Prevent potential failure risksIdentify weaknesses (such as metal fatigue, solder joint cracking, and package delamination).

3. Meet international standards and automotive regulations.Assist products in passing reliability standards such as AEC-Q100, JEDEC, IPC, and MIL-STD.

In electric vehicles and automotive electronic systems, power supply, power conversion, and energy management modules need to endure for a long time.High voltage, high current, high temperature, and frequent switching operationsits design core relies on the stable operation of power components such as IGBT and MOSFET. Once a power component fails, it may lead to system derating at best, or cause abnormal vehicle functions and even safety risks at worst.Component Reliability Testinghas become an indispensable verification process in automotive electronics, industrial power supplies, and high-power applications.

MA-tek provides a completeEnvironmental stress, lifetime simulation, and electrical verification capabilitiesThis assists customers in fully grasping the reliability performance and failure risks of power components before product development and mass production, creating safer and more stable solutions for automotive and high-power applications.

Overall framework of component reliability verification

The reliability assessment of components cannot be completed with a single test, but requires a comprehensive approach.Environment, lifespan, and electrical propertiesThree levels, comprehensively verifying the component's tolerance and failure mechanisms under actual application conditions.

Environmental stress testing is mainly used to simulate the temperature, humidity, and mechanical stress conditions that power components may encounter during manufacturing, packaging, transportation, and actual operating environments. By using accelerated methods, potential weaknesses in materials, packaging, or structures can be exposed early, effectively assessing the structural stability of power components in harsh automotive and industrial environments. Common test items include:

• Preconditioning (PC): Simulating reflow and moisture exposure conditions

• High Accelerated Temperature and Humidity Test (Autoclave, AC / UHAST): Assessing packaging moisture resistance and interface reliability

• Temperature Cycling Test (TC): Verify the thermal fatigue behavior of solder joints and materials

• Terminal Strength Test (TS): Confirm the mechanical strength of the terminal and packaging.

• Resistance to Solder Heat (RSH)

• Thermal Resistance (TR): Assessing the heat dissipation efficiency of power components.

• Solderability Test (Solderability, SD)

• Whisker Growth Evaluation (WG)

• Constant Acceleration (CA)

• Vibration Variable Frequency (VVF)

• Mechanical Shock Test (Mechanical Shock, MS)

Accelerated life testing is one of the core items for the reliability verification of power components, applicable to IGBT and MOSFET in high power applications such as inverters and automotive power modules, throughHigh temperature, high humidity, and bias conditionsto simulate the aging and failure behavior of components under long-term operation, MA-tek can plan suitable lifetime test conditions based on the characteristics of the components and application scenarios. Common items include:

• High Temperature High Humidity Reverse Bias Test (H3TRB): Assessing degradation caused by the interaction of moisture and electric fields.

• Intermittent Operational Life (IOL)

• Power Temperature Cycling: Simulating actual on-off load conditions

• High Temperature Reverse Bias Test (HTRB): Assessing the long-term voltage withstand capability of structures and junctions.

• High-Temperature Gate Bias Test (HTGB): Confirm the reliability of the gate oxide layer and dielectric.

• Power Cycling Test (Power Cycling, PCsec / PCmin): Simulate repeated power switching and thermal stress accumulation effects.

Electrical verification is used to confirm the stability of electrical parameters of power devices before and after testing, and combined with special electrical tests to assess their tolerance limits and failure modes, including: