Package Structure
The packaging structure and appearance are the first line of defense in assessing process quality. Through the measurement of appearance, dimensions, and structure, packaging deformation, warping, or structural abnormalities can be detected early, preventing the problem from escalating further.
Optical Microscope
Non Contact 3D Surface Profiler
Applications
- Flatness, surface roughness, step height, deformation and waviness
- 2-D and 3-D profile
Advantages
- Accurate, fast and no sample preparation is needed
- An extremely wide range of surface heights is capable to be profiled. (~180μm)
- The benefits of optical surface profilometry include
- Excellent height resolution
- High measurement speed
- Ability to perform non-contact measurements of delicate surfaces
Surface defects characterization
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(a) OP; (b) SEM; (c) LED; (d) Au Bump
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100 μm Bump Profiler
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20 μm Bump Profile
SEM Imaging
