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AES OJ Electronics Energy Spectrum Analyzer

Technical Principles

Auger Electron Spectroscopy (AES) is a high-resolution surface elemental analysis technique that can be used to analyze the elemental composition and chemical state of extremely thin layers on the surface of materials. MA-tek is equipped with the JEOL JAMP-9500F field emission scanning Auger electron spectrometer (FE-AES), which is equipped with a hemispherical energy analyzer (HSA) that provides an electron energy resolution of up to 0.05%. The system also features high-resolution scanning electron microscope capabilities, with an image resolution of up to 3 nm, and an Auger Mapping spatial resolution of approximately 8 nm. AES utilizes a high-energy electron beam to bombard the surface of the sample, exciting inner-shell electrons and generating Auger electrons. Since the Auger electrons produced by different elements have specific energies, the elemental types and distribution of the material can be determined through the energy analyzer. AES has extremely high sensitivity to surfaces and can typically analyze elemental information at a depth range of about 5–8 nm, making it suitable for surface contamination analysis, thin film interface analysis, and materials research. Additionally, AES can be combined with ion etching for depth profiling analysis to observe the elemental distribution and diffusion between multilayer films. Through database comparison, chemical state analysis can also be conducted, particularly suitable for materials systems with transition metal elements and multiple coexisting chemical states.

Analysis Application

Trace Impurity Analysis

Can detect impurity elements at concentrations above approximately 0.1%.

Oxide layer thickness assessment

Evaluate the thickness of the oxide layer or film on the material surface.

Surface Elements and Semi-Quantitative Analysis

Analyze the elemental composition and relative content of the material surface.

Chemical state analysis

Determine the chemical bonding and oxidation state of the elements.

Surface Cleanliness Monitoring

Analyze the residual contaminants on the product surface and the cleanliness of the material surface.

AES Element Mapping

Obtain images of element planar distribution at the nanoscale.

AES Deep Analysis

Combined with ion etching, it can measure the distribution of material composition changes with depth.

OJN Multi-Point Analysis

Conduct qualitative and semi-quantitative analysis of elements in multiple micro-area locations.

Types of machines

Field Emission Auger Electron Spectroscopy (JAMP-9500F)

It can provide high-resolution surface elemental analysis capabilities at the nanoscale. The system combines a high-resolution scanning electron microscope (SEM) with Auger electron spectroscopy technology, allowing for simultaneous observation of surface morphology and elemental analysis.

JAMP-9500F uses a hemispherical energy analyzer and a high-brightness field emission gun, providing high energy resolution and excellent spatial resolution. This equipment is particularly suitable for nanoscaleSurface element analysis, contamination analysis, and thin film interface research：

The resolution of SEM images can reach approximately 3 nm.
Auger Mapping resolution can reach approximately 8 nm.

Common applications include:Surface contamination and residue analysis,Analysis of element distribution in thin films and multilayer structures,Surface oxide layer and interface analysis,Nano-scale element mapping,Semiconductor process and material failure analysis,Through high-resolution surface analysis capabilities, FE-AES can provide material surface approximately5–8 nm depth rangethe elements and chemical information, is an important tool for analyzing nanometer-scale materials and microelectronic components.