AI training and high-speed computing have extremely high demands on data processing speed, energy efficiency, and memory bandwidth. Therefore, chips such as GPU, TPU, and NPU commonly adopt high-density advanced packaging, including HBM stacking, Chiplet modular integration, TSV through-silicon vias interconnection, and RDL redistribution architectures.
This type of packaging has characteristics of high frequency, high power, and high thermal load. During system operation, it is accompanied by risks such as uneven thermal delay, package warpage, interface fatigue, and shortened bump joint lifespan. If the internal structure, thermal behavior, and material interaction status of the packaging cannot be grasped in a timely manner, reliability issues are likely to arise during mass production or long-term operation.
MA-tek's core capabilities in the field of AI and high-performance computing are:
Can simultaneously establish the true cross-section of the packaging structure, stress/thermal behavior models, and corresponding failure mechanisms.
Through high-resolution structural reconstruction, packaging thermal behavior analysis, interface material tracking, and lifetime verification, we assist customers in preemptively grasping packaging stability under extreme conditions during the R&D phase, reducing yield loss in later stages, and supporting products entering high power and long-duration computing scenarios.
| Service Direction | Focus Areas | Applicable scenarios | MA-tek assistance |
|---|---|---|---|
| Chiplet packaging structure reconstruction | TSV, Micro bump, RDL, HBM stacking quality | Advanced packaging introduction / Stacking consistency verification | 3DX-Ray, C-SAM, FIB-TEM, hierarchical structure reconstruction |
| Packaging thermal behavior and heat dissipation design assessment | thermal resistance distribution, thermal diffusion bottleneck, TIM performance | Long-term operations, server/AI training GPU high power scenarios | IR thermal imaging, TIM thickness analysis, FEM thermal simulation, thermal degradation assessment |
| Reliability analysis of high-frequency and high-speed signal paths | Conductive interface, interconnection lifespan, stress concentration | Long-term computation, server/AI training GPU high power scenarios | FIB-TEM, XPS, solder joint fatigue and stress model retrospective |
| Long-term lifespan and board-level verification of ultra-high power packaging | Warping, packaging fatigue, solder joint life degradation | HPC / AI Server mass production and certification requirements | FIB-TEM, XPS, solder joint fatigue and stress model retrospective |
