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HOME Technical Articles Reliability Testing Quick Understanding of the Highlights of the 2025 Edition AQG 324 Specifications
Reliability Testing
05.01
2025
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Quick Understanding of the Highlights of the 2025 Edition AQG 324 Specifications

With the rapid development of electric vehicles and high-performance power technologies, the reliability and lifespan of power modules have become crucial in automotive electronic design. The 2025 version of AQG 324 v4.1 officially launched this May, providing stricter and more targeted testing standards for automotive verification, especially for the application of silicon carbide (SiC) power modules.

What is AQG 324?

AQG 324 is a testing guideline for automotive power modules led by ECPE (European Center for Power Electronics), covering the complete process from characteristic verification, environmental testing to lifespan testing. Although it is not a mandatory standard, it has become a quality consensus threshold between automakers and the supply chain.

Three major highlights of the 2025 version

  1. Strengthen testing requirements for SiC modules:The new version introduces 11 additional testing conditions and failure mode analyses for the high-temperature and high-voltage characteristics of SiC. Among the 11 testing projects, tests such as HTGB (High-Temperature Gate Bias), DGS (Dynamic Gate Stress), H3TRB (High Humidity High Temperature Reverse Bias), and DRB (Dynamic Reverse Bias) can effectively reveal the potential failure risks of SiC modules under extreme conditions. Unlike Si modules, the new tests include DGS (Dynamic Gate Stress), DRB (Dynamic Reverse Bias), and dyn. H3TRB (Dynamic High Humidity High Temperature Reverse Bias) dynamic lifetime tests, expanding the verification range from static operation to simulating the fatigue effects of modules under dynamic operation.

  2. Refined power cycling tests:The new version divides power cycling into two modes: "second-level" and "minute-level" as shown in the figure below, targeting the thermal shock limit capability at the chip and substrate solder joints and the structural integrity of the heat sink. This helps to more accurately simulate the aging behavior under actual automotive mission profiles.
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3.Design-oriented testing philosophy:AQG 324 is not only a verification standard but also a concept of "Design for Quality." From chip design, packaging technology to module layout, considerations must be made on how to incorporate AQG 324 testing.

Why is the testing of AQG 324 important?

For automotive power module suppliers, the ability to pass the AQG 324 test directly affects whether their products can enter the mainstream automotive supply chain. For the new generation of modules using SiC, this standard is even more crucial as the core basis for design and verification.
 

Conclusion

The 2025 version of AQG 324 is not only a technical update but also a comprehensive upgrade to the reliability of automotive power modules for the future. In light of this, MA-tek has already laid out the dynamic lifespan testing energy that meets the new AQG 324 standards, allowing customers to quickly establish themselves in the era of electric vehicles.

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