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MA-tek News
04.01
2025
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MA-tek focuses on the world's most advanced semiconductor testing technology and investment layout.

The world's top ultra-atomic imaging resolution electron microscope is activated to support the research and production of processes below 2nm.

 

With industry-leading advanced process and packaging analysis technology, MA-tek has long provided global semiconductor leaders with GAAFET (Gate-all-around Field-Effect Transistor) structure inspection and advanced packaging failure analysis solutions such as CoWoS (Chip on Wafer on Substrate) and InFO (Integrated Fan-Out). To assist wafer manufacturers in advancing the R&D and mass production of processes below 2nm, MA-tek has invested in a world-class ultra-high-resolution spherical aberration-corrected transmission electron microscope (Cs Corrector TEM) at the Hsinchu Science Park Silicon Laboratory.

 

The total investment in the equipment exceeds 5 million USD, with a height of up to 3.3 meters, and the purchase price is more than three times that of traditional electron microscopes. Its outstanding imaging performance can accurately analyze dumbbell-shaped symmetrical images below 1nm, presenting details of atomic arrangements at the sub-angstrom level, providing unprecedented analytical capabilities for the study of materials and structures in processes below 2nm, accelerating innovation in semiconductor technology. The equipment has been installed and officially put into service today (2025/4/1).

 

MA-tek has long been committed to research and development in cutting-edge technology and has accumulated several years of experience in ultra-atomic detection and analysis. In 2019, it installed another ultra-high resolution atomic resolution transmission electron microscope (Neo ARM) at its laboratory in Nagoya, Japan. This microscope is not only equipped with spherical aberration correction and provides ultra-high resolution images, but also has EELS functionality, which can better meet the detection needs of customers, adding more analytical capabilities to the structural analysis laboratory, and is used by Toyota Motor Corporation and Denso Research Center.

 

 

  • Spherical Aberration Corrected Transmission Electron Microscope (ThermoFisher Metrios AX TEM)

  • The imaging results of the dumbbell-shaped symmetrical arrangement of silicon materials at the sub-angstrom level. 1 micrometer (μm) = 1000 nanometers (nm) = 10000 angstroms (Å)

the world's first nano-scale quantum device 3D imaging analysis technology

 

In recent years, MA-tek has collaborated with Professor Li Pei-wen from National Yang Ming Chiao Tung University to conduct industry-academia cooperation in the manufacturing and synthesis of quantum devices. Utilizing the 3D imaging technology of the microscope, they successfully established the world's first three-dimensional images of quantum dot devices. The 3D imaging technology provides atomic-level structural information of quantum dot devices in quantum computing and silicon photonics applications, accurately analyzing the geometric morphology, diameter, and crystal orientation of quantum dots, thus advancing the research progress of qubits, quantum sensing technology, and silicon photonic devices. This groundbreaking tool not only achieves high sensitivity detection but also enables precise three-dimensional structural analysis, laying the foundation for the development of quantum computing and silicon photonics technology. Figures 1 and 2 illustrate the 3D imaging construction technology of germanium quantum dot (Quantum Dots, QDs) devices.

 

  • Figure 1. The overall specimen after 3D reconstruction, which allows for the examination of any cross-sectional structure within the volume. The white dot-like objects are germanium quantum dots.

  • Figure 2. The red area is the germanium quantum dots, which allows the entire sample to be rotated 360 degrees to observe the overall arrangement of the QDs.

Expand investment in ultra-high power reliability verification equipment to meet the demand of the AI chip market.

 

To meet the reliability testing needs of high-end AI chips, MA-tek completed the installation of 2 Incal/Sonoma machines and 2 MCC/HPB6 machines in the first quarter of 2025, with the capability to verify power levels of up to 800 watts and 1500 watts per IC, leading globally among laboratories. The equipment has received verification projects from top autonomous vehicle and AI chip manufacturers in Europe and the United States, covering single device, board-level, and module testing, providing critical reliability verification services for the global AI market.

 

This investment will further strengthen MA-tek's technological advantages in the field of AI chip reliability verification and is expected to bring significant revenue growth starting from the fourth quarter of 2025, continuously consolidating its competitive edge in the semiconductor testing and analysis market.

 

  • MCC HPB6 ultra-high power pre-baking furnace (1500W)

  • Incal Sonoma ultra-high power pre-burner (800W)

 

Looking to the future, actively expanding the global market territory.

 

As semiconductor technology continues to evolve, MA-tek will continue to increase investment in technology research and development and equipment, deepen cooperation with the global semiconductor supply chain, and actively expand into international markets. With continuous innovative breakthroughs and technological leadership advantages, MA-tek will continue to provide the most advanced and precise semiconductor analysis and testing services to global customers, further consolidating its market leadership position.

 

新聞連結

 

 

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01.16
2026
This seminar is themed "Silicon Exploration of the Future: The Intelligence Quest of AI × Silicon Photonics," emphasizing how the integration of AI, high-speed computing, silicon photonics, and advanced packaging technology redefines computing efficiency. The concept of "Intelligence Quest" symbolizes the identification and analysis of the best opportunities for future technological development through these key technologies.
For more information: https://www.matek.com/zh-TW/Seminar/detail/all/20250327
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