MA-tek advances to ISTFA 2025
MA-tek will participate in the annual microelectronics failure analysis event "ISTFA 2025" held in Pasadena, California, USA on November 18-19, 2025!
This year's ISTFA theme focuses on "Beyond Moore's Law Expansion: Heterogeneous Computing and Advanced Packaging." In the face of the rapid growth of Chiplet, advanced packaging, 3D stacking, and heterogeneous architecture integration, failure analysis has become a key link in product design and reliability verification.
MA-tek will share its practical experience in advanced packaging and heterogeneous architecture integration, leveraging its expertise in materials analysis, failure analysis, and reliability verification. From interface behavior to root cause of failure, we provide analytical perspectives that support design and mass production decisions!
We sincerely invite you to join us for discussions on the key issues of the next stage of semiconductor packaging and reliability.
Exhibition Information
- Exhibition date: 2025/11/18–19
- Exhibition location: Pasadena Convention Center
- Booth number: #629
- Poster location: #64487
