![[MAFT 2025 | H2] Driving the Future – Challenges in Validating Automotive Sensing Technologies and Autonomous Driving](https://www.matek.com/upload/news_support_list_pic2/twL_news_support_25H19_fMh5UEza14__26H03YPH1a.png)
[MAFT 2025 | H2] Driving the Future – Challenges in Validating Automotive Sensing Technologies and Autonomous Driving
On the road to autonomous driving, cars are no longer just a means of transportation, but rather mobile intelligent terminals that integrate sensors, AI chips, composite materials, and innovative manufacturing technologies. This technological competition not only tests innovation but also poses an extreme challenge to "reliability." As self-driving cars and smart vehicles quickly become the new norm, sensing technology, material innovation, and module verification are rising as the core driving forces for vehicle intelligence. In the face of rapidly evolving technology, how can companies break through steadily and seize market opportunities?
On September 24, MA-tek sincerely invites you to attend the 2025 MAFT seminar! This year's theme is "Driving the Future," focusing on automotive sensing and module verification, from failure analysis, material development, automotive module validation to advanced analysis, gathering frontline technical insights and practical experiences in four key areas.
Let us join hands with industry leaders to deeply analyze the key technological pathways from materials to modules, and from testing to verification, to explore the next breakthrough in smart driving.
Registration website:https://forms.office.com/r/DX8CdktmYe
Kind reminder: Due to limited seating on-site, if the number of registrations is full, we will notify you to switch to online participation. We appreciate your understanding and support.
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Time |
Speaker |
Theme & Outline |
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|---|---|---|---|
| Morning - Industry-Academia Collaboration (In-person Event) | |||
| 09:30~10:00 | Registration | ||
| 10:00~10:20 | Opening & Guest Speech & Group Photo | ||
| 10:20~10:40 |
National Yang Ming Chiao Tung University Institute of Electronics Professor Chen Guan-neng |
Research on High Alignment Accuracy Technology for Silicon Wafer Bonding Assisted by AI | |
| 10:40~11:00 |
National Yang Ming Chiao Tung University Institute of Electronics Professor Wu Tianli |
Reliability and failure mechanism analysis of high voltage (>1.2KV) GaN power devices applied in electric vehicles | |
| 11:00~11:20 |
National Yang Ming Chiao Tung University, Department of Photonics Professor Guo Haozhong |
Indium Phosphide Laser and Silicon Photonic Integration | |
| 11:20~12:00 |
Poster Exhibition and Discussion |
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| 12:00~13:00 |
Lunch gathering |
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Afternoon - MAFT Seminar(In-person/Online Event) |
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| 13:00~13:20 |
Registration |
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| 13:20~13:30 |
Opening |
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| 13:30~14:30 |
Failure Analysis Lin Yu-teng Director
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Topic: Total-solution FA Procedure and Case study of Power & Compound semiconductor |
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| 14:30~15:30 |
National Tsing Hua University Semiconductor Institute Professor Fang Weilen
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Theme: Application of Piezoelectric Thin Films in MEMS | |
| Piezoelectric materials are regarded as a type of smart material and have been widely applied in many fields such as ultrasonic probes, precision positioning, sonar, vibration sensors, and buzzers. In recent years, with the development of various processing technologies, piezoelectric films have become one of the key technologies driving the development of micro-electromechanical systems (MEMS) actuators. This presentation will first briefly introduce the basic principles and characteristics of piezoelectric films and explain how to characterize and analyze material properties. Next, through several representative application cases, it will demonstrate the potential and achievements of piezoelectric films in advanced MEMS devices, including LiDAR for autonomous vehicles, heads-up displays (HUD) for smart cars, and micro speakers. Finally, it will provide insights into the future development directions and challenges of piezoelectric films in MEMS applications, hoping to inspire more innovative research and applications of smart materials and smart devices. | |||
| 15:30~16:00 |
Networking & Break |
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| 16:00~17:00 |
Reliability Analysis Deputy Director Zhang Quan-Jun
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Theme: Key to the Era of Autonomous Vehicles - Analysis and Verification of Automotive Modules and Challenges |
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With the rapid evolution of autonomous vehicle technology, vehicles are no longer just a means of transportation, but have become highly intelligent mobile platforms. From sensors to control units, from communication modules to artificial intelligence (AI) chips, each automotive module plays an indispensable role. In this technological revolution, "module verification" has become a key link to ensure safety, stability, and reliability.
At present, automotive module verification in the AEC-Q verification family is divided into two main categories: Multichip Module (MCM) and Optoelectronic Multichip Module (OE-MCM), referring to standards such as AEC-Q104 and AEC-Q102-003. The verification framework is divided into general common verification and special verification. Due to the wide variety of automotive module types, there are often issues with the applicability of certain test items. Therefore, it is essential to have professional verification experience like that of MA-tek to tailor verification solutions that meet the standards, allowing automotive modules to quickly and safely enter the new era of smart driving! |
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| 17:00~18:00 |
Material Analysis Manager Chu Keng-Chieh
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Topic: Advanced Material Analysis in Automotive Electronics Applications |
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The content covers the development trends of the automotive semiconductor market and the key role of Transmission Electron Microscopy (TEM) in advanced processes and power devices. The presentation explains the basic principles of TEM technology, three-dimensional observation methods (planar and cross-sectional), ALD coating technology, spherical aberration correction, automatic image measurement, EBSD and TKD grain analysis applications, and provides specific analysis cases for IGBT and SiC power devices. MA-tek also demonstrates its integration of high-resolution instruments, AI automatic measurement, and professional analysis capabilities, emphasizing the ability to provide customized, precise, and efficient analytical solutions to help improve the quality and reliability of automotive electronic components. |
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| 17:50~18:00 |
Event Lottery & Return |
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