MA-tek advances to ISTFA 2025
MA-tek will participate in the annual microelectronics failure analysis event "ISTFA 2025" held in Pasadena, California, USA from November 18 to 19, 2025!
This year's ISTFA theme focuses on "Expanding Beyond Moore's Law: Heterogeneous Computing and Advanced Packaging." In the face of the rapid growth of Chiplets, advanced packaging, 3D stacking, and heterogeneous architecture integration, failure analysis has become a key link in product design and reliability verification.
MA-tek will leverage its expertise in materials analysis, failure analysis, and reliability verification to share practical experiences in advanced packaging and heterogeneous architecture integration, providing analytical perspectives that support design and mass production decisions, from interface behavior to failure root causes!
We sincerely invite you to join us for discussions on the key issues of the next stage of semiconductor packaging and reliability.
Exhibition Information
- Exhibition date: 2025/11/18–19
- Exhibition location: Pasadena Convention Center
- Booth number: #629
- Poster location: #64487
