High-resolution non-destructive three-dimensional morphology analysis technology and industrial applications

In recent years, with the rapid development of high-performance computing (HPC), artificial intelligence (AI), advanced packaging (2.5D / 3D IC), and high-density PCB technology, component structures continue to shrink, and process tolerances have significantly decreased. Surface roughness, structural height differences, microstructure profiles, and packaging morphology control have become key factors affecting yield and reliability.