Breaking the Limits of Moore's Law: Key Applications of Advanced Packaging Technology and Heterogeneous Integration Analysis
Moore's Law predicts that the number of transistors on an integrated circuit will double every 18 months for the same area, and the performance of chips will continue to improve. After nearly 60 years of guiding the development of the semiconductor industry, this law is gradually approaching its limits. Major manufacturers are also thinking of new solutions, hoping to continue improving the overall performance of chips without being able to shrink transistors, and to achieve performance breakthroughs by stacking semiconductor circuits layer by layer through system integration.
The most important memory embedded in AI chips - Static Random Access Memory (SRAM) advanced process structure inspection and analysis.
In such complex IC circuits, the heaviest embedded memory in AI chips is SRAM (Static Random-Access Memory). This type of embedded SRAM is also known as embedded SRAM.
Circuit Repair Technology Solutions and Processes
In the design and manufacturing process of ICs, products after research and development tape-out require functional verification to confirm whether they meet testing standards. However, there are often performance differences and even functional defects. At this point, design debugging is necessary to identify the issues, revise the design, and reproduce the product. This entire process forms a loop; the faster the problems are identified, the quicker the time to market for the product.
