Insight into minute defects, safeguarding excellent quality - voids are no longer a problem, vacuum reflow soldering creates high reliability in SMT soldering quality.
In response to the market trend for high-reliability solder joints, MA-tek provides advanced SMT vacuum reflow soldering services, specifically designed for high-power and high-reliability electronic components, effectively reducing void rates and enhancing solder joint reliability.
AEC-Q006 2025 Edition Key Changes Full Analysis
AEC-Q006 is a reliability validation standard established by the Automotive Electronics Council, specifically for automotive electronic components that use copper wire as the interconnection material for chip packaging. The establishment of this standard is derived from the trend of copper wire gradually replacing traditional gold wire in packaging technology.
Exploring the world of verification for automotive modules
Automotive modules are currently divided into two main categories in the AEC-Q verification family: Multichip Module (MCM) and Optoelectronic Multichip Module (OE-MCM).
__26H03qt8B7.png)
Quick Understanding of the Highlights of the 2025 Edition AQG 324 Specifications
AQG 324 is a testing guideline for automotive power modules led by ECPE (European Center for Power Electronics).
MA-tek establishes a service model for verifying the integrity of power components.
The high voltage and high frequency characteristics of power devices (SiC, GaN) related to power supply play a crucial role in electric vehicles. Due to the critical role of power devices in electric vehicles, many companies are seizing this trend and are actively investing in the research and development of power devices.
