Breakthrough in High Power Chip Testing Limits: MA-tek Launches CoWoS Hybrid Power Latch-Up Testing Solution
When CoWoS advanced packaging power consumption exceeds one kilowatt, traditional Latch-Up testing platforms often face the fatal pain points of "insufficient power supply units" and "current cannot be pushed (only 10A per unit)". MA-tek's strongest solution: "MK4 + hybrid power system" equips the testing platform with a powerful "external heart", perfectly breaking through physical limitations!
High-resolution non-destructive three-dimensional morphology analysis technology and industrial applications
In recent years, with the rapid development of high-performance computing (HPC), artificial intelligence (AI), advanced packaging (2.5D / 3D IC), and high-density PCB technology, component structures continue to shrink, and process tolerances have significantly decreased. Surface roughness, structural height differences, microstructure profiles, and packaging morphology control have become key factors affecting yield and reliability.
